DCSIMG

Glass Micro Bonding for Glass and Silicon Substrates

SCHOTT Primoceler – R&D and Process Validation

We work with our customers on the best possible design to meet your requirements. Our experience in the Aerospace and Medical industries gives us the know-how to find the right solution for you.

SCHOTT Primoceler – Service Manufacturing and WLP Production

Our facilities are equipped to handle any bonding needs, from chip scale to 12 inch WLP. Our process has been verified by multiple studies as well as mass production projects.

SCHOTT Primoceler Glass Micro Bonding Benefits

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The bond is fully hermetic

It’s strong and durable

Ultra-high precision without heat or added materials

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Read More About What We Can Offer

We serve multiple industries with a wide range of applications. Take a look at some examples and the benefits that we can offer.

Applications
Technology

FAQ

Which wafer sizes can you bond?
Currently our lab is equipped to handle up to 12” wafers. This is limited by customer needs and we are ready to move into panels.
How fast is the bonding process?
As a linear process, the bonding speed depends on the wafer design – the process is much faster when the die number per wafer is lower. However, since the whole bonding can be done in one step without preheating or cooling down, the effective speed is faster than with traditional methods.
Do you have a job shop in the US?
Right now all of our service manufacturing is done in Finland, Europe. We are currently working with our customers to build a new process center in California.
What materials can you bond?
Primoceler technology shows its greatest advantages in glass to glass bonding and glass to silicon bonding. Almost all glass types are suitable. We have used SCHOTT BOROFLOAT® 33,  SCHOTT D 263®, SCHOTT AF 32® eco, SCHOTT MEMpax®, soda lime, fused silica and different types of quartz glass. Most glass substrates can be supplied with SCHOTT  HermeS® TGV (Through Glass Via) technology or as structured wafers and thin glass using the SCHOTT FLEXINITY™ structuring process. Sapphire to sapphire is still considered “under development”.
Are there any additive layers or coatings needed?
No. No additives or coatings are needed during the bonding process.
Can I package heat sensitive components?

Absolutely. With our process, the Heat Affected Zone (HAZ) is extremely small. We have measured under 1’C change just 100 um from the bonding line.

Is it possible to have a vacuum inside the cavity?
Yes. We have developed a proprietary technology to achieve a high vacuum and seal with minimal heat load.

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