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Data and Telecommunication

Advanced communication networks depend on complex electronic systems, with SCHOTT supporting their demands for more data in less time. Our TO PLUS® packaging components enable high speed data transmission, while antenna materials and all-glass wafer level chip sale packaging offer exciting new possibilities. 


With increasing demands in data transmission, optical and optoelectronic components are becoming more delicate and susceptible to damage. They require reliable protection while enabling highly precise optical signal transmission. With TO PLUS® packages for up to 50 gigabits per second, SCHOTT continues to lead the way in packaging for ultra-high speed networks. In addition, SCHOTT’s Primoceler™ hermectic glass micro bonding technology is ushering in a new era of cutting-edge, ultra-reliable wafer level chip scale packaging.


The potential of glass and glass-ceramic for use in high-performance antennas, such as transmitter masts for mobile communications, is a thrilling area of research and development. Known for their low loss of electromagnetic radiation, SCHOTT's range of thin glasses serve as antenna array substrates, offering a higher degree of miniaturization, higher efficiency and lower susceptibility to interference compared to traditional materials.

High Power Electronics

With 5G technology on the rise, data volumes, transmission speeds and processing requirements are more demanding than ever, and with it comes the challenge of increased heat generated by components and systems. Decades of experience in optoelectronics, aerospace and automotive have helped SCHOTT create a range of hermetic and heterogeneous packaging components that provide long-term protection and mechanical stability for high power electronics, enabling efficient power and signal transmission.

RF Filters

RF filters are a key component to enable high bandwidth communication for today's smartphones. Our glass substrates add structure to RF filters and ensure mechanical stability.

IC Packaging

Integrated circuit packaging is essential for protecting data and telecom electronics, but selecting the appropriate packaging is becoming more complex. SCHOTT offers a broad variety of materials and components that cater to different I/O numbers, heat management properties, high speed capabilities, different assembly methods, and environmental requirements. Our products enable high-performance packaging such as SMD- and wafer level chip-scale (WL-CSP), multi-chip module, glass interposer and high speed transistor outline packaging.