Glass-ceramics: SCHOTT NEXTREMA® temperature resistance and
thermal properties

Thermal resistance and resistance to temperature shocks depending on the type of up to 820 °C

Will NEXTREMA® exceed your expectations when it comes to temperature resistance too? Find out! The material platform withstands high and low temperatures and offers outstanding resistance to temperatures depending on the type of up to 950 °C. From hot to ice cold and back again: even quick changes in temperature from one extreme to another will have little impact on this heat resistant glass-ceramic. This keeps fractures due to thermal stress to a minimum – even with temperature shocks of up to 820 °C. This resistance to temperature change makes NEXTREMA® top choice for high-temperature applications.

Linear thermal expansion coefficient (CTE) (DIN ISO 51045-1, DIN ISO 7991)

These outstanding thermal properties can be attributed to our glass-ceramics’ thermal expansion of almost zero.

These unique property combinations make SCHOTT NEXTREMA® glass-ceramic a promising partner in industrial and product design. Belwo you can find a detailed description of all the thermal properties. The following mean coefficient values and the graph show the temperature dependency:

CTE in different temperature ranges

α (-50 °C; 100 °C) -0.8 – 0.6 x 10-6 K-1  
α (0 °C; 50 °C) -0.8 – 0.6 x 10-6 K-1
α (20°C; 300 °C) -0.4 – 0.9 x 10-6 K-1
α (300°C; 700 °C) 0.1 – 1.6 x 10-6 K-1
Thermal expansion in dependence on the temperature

Specific heat capacity

Cp (20 – 100 °C) 0.80 – 0.85 J / (g x K)  

Thermal conductivity
(DIN 51936, ASTM E 1461-01)           

λ (90 °C) 1.5 – 1.7 W / (m x K)

Homogeneous heating of the material
TTLC / Short term load (1h) >650 – 950 °C / 1,202 – 1,742 °F 
TTLC / Continuous load (5000 h) >550 – 850 °C / 1,022 – 1,562 °F

Inhomogeneous heating of the material
TTLC / Short term load (1h) 450 – 750 °C / 842 – 1,382 °F  
TTLC / Continuous load (5000 h) 400 – 560 °C / 752 – 1,040 °F
MTG 400 – 800 K
Resistance of the material to temperature differences between a defined hot zone and cold edge of room temperature, without cracking due to thermal stress.
Maximum temperature 
gradient (MTG)
TSR 600 – 820 °C ( 1,112- 1,508 °F)
Resistance of the material to thermal shock when the hot material is splashed
with cold water at room temperature, without cracking due to thermal stress.
Thermal shock resistance 
The temperature / time load capacity specifies the maximum permissible temperatures for load times of the material, below which no cracking should occur due to thermal stress. The temperature / time load data for uneven and even temperature distributions (e.g. homogeneous heating conditions) within the
material are different.
   Temperature/time load capacity (TTLC)
Further information on request.