Welcome to SCHOTT Semicon next
An expert-led series for those navigating the industry’s next chapter – where advanced packaging and new materials are reshaping how computational growth continues.
How does glass compare with organic substrates, ceramics and silicon?
Dr. Jochen Alkemper explores material performance in advanced packaging, from thickness tolerances and thermal expansion to stiffness and precise through-glass via (TGV) formation.
What does it take to integrate glass at manufacturing scale?
Dr. Timo Luchs guides you through material selection, TGV formation, reliability testing, and the practical considerations that support successful integration at scale.
How can advanced packaging extend semiconductor scaling?
Colin Schmucker explors how glass can help extend performance scaling and support the next generation of advanced packaging and high-performance semiconductor technologies.
What if glass enables next-gen chips?
As transistor scaling approaches physical limits, specialty glass is emerging as a promising material for advanced packaging. Through in-depth video sessions and technical whitepapers, our experts break down all the ways glass can support higher performance, improved energy efficiency, and scalable system architectures designed for advanced computing.
A legacy you can build on
With more than 140 years of specialty glass expertise, we’ve established enduring partnerships with almost every facet of the semiconductor industry.
- Decades of experience in microlithography and optical materials
- Dedicated technology focused on glass core substrates and advanced carrier applications
- A structured panel sample line supporting TGV development, prototyping, and validation
- Global application engineering teams across Europe, the US, and Asia
This series brings all our expertise under one roof, so you can gain data-driven insights shaped by real-world collaboration across the value chain.
What you can expect from Semicon next
Why register?
Get full access to expert-led sessions and technical whitepapers focused on the role of glass in next-generation semiconductor packaging.
Explore the modules
Semicon next leads you through thematic modules – each addressing a critical dimension of advanced packaging. From the limits of transistor scaling, to material performance comparisons, to industrial adoption pathways, each module builds on the last.
How does glass compare with organic substrates, ceramics and silicon?
Material performance in advanced packaging
Performance, energy efficiency, and integration density increasingly depend on substrate properties. In this session, Dr. Jochen Alkemper explains how glass offers tight thickness tolerances, controlled coefficients of thermal expansion, high stiffness, and precise through-glass via (TGV) formation.
Dr. Alkemper offers a structured comparison with organics, ceramics, and silicon, highlighting implications for reliability, miniaturization, and scalability in AI and HPC applications.
Click play for a sneak preview.
Register below to watch the full episode.
Glass compared to alternative substrates
How does glass stack up to other substrate materials? This whitepaper presents a technical, data-driven comparison of glass, polymers, ceramics, and silicon for advanced packaging. It examines thermal expansion control, mechanical stability, structuring precision, and panel scalability – factors that influence integration density, reliability, and long-term manufacturability.
What does it take to integrate glass at manufacturing scale?
Enabling reliable glass integration at scale
Transitioning to glass involves material selection, process adaptation, and supply chain alignment. In this session Dr. Timo Luchs explores glass selection criteria, TGV formation, handling considerations, simulation support, and reliability validation under realistic conditions.
Learn how we support customers from early sampling through production integration, helping ensure consistent quality and stable high-volume output.
Click play for a sneak preview.
Register below to watch the full episode.
From validation to fab-scale production
This whitepaper outlines the pathway from laboratory validation to implementation in semiconductor manufacturing. It addresses glass selection, process compatibility, structured sampling, and collaborative development models designed to support reliable integration into existing production environments.
How can advanced packaging extend semiconductor scaling?
Advanced packaging and continued scaling
For decades, computational growth relied on shrinking transistors. As scaling approaches physical limits and quantum effects emerge at sub-5 nm nodes, system-level integration becomes increasingly critical.
In this expert session, Colin Schmucker examines how glass is reshaping the semiconductor industry by propelling advanced packaging and high-performance semiconductor technologies to the next level.
Click play for a sneak preview.
Register below to watch the full episode.
Beyond transistor scaling: the material shift
This whitepaper examines the physical and economic limits of transistor miniaturization and outlines how advanced packaging extends computational scaling. It explores the role of glass-core substrates in supporting thermomechanical stability, fine-pitch interconnects, and heterogeneous integration.
Interested in how glass could support your semiconductor applications? Let’s talk.
Whether you need additional information, samples, a quote, or project guidance, our team would be happy to connect with you.
