Cool Copper Headers for Transistor Outline Packages

Heat removal features for high power or visible light laser applications.

About

Whenever high power lasers are used, removal of the created heat can be an issue. Copper with its very high thermal conductivity helps with this challenge. Cool Copper header is suitable for use in Gesture recognition applications, Pico projectors, LiDAR, Automotive headlights etc.

Product features

  • Thermally-conductive copper heat sink or slug brazed on to TO base.
  • Copper shape can be customized.
  • High transverse positioning accuracy better than ± 0.03mm (< < 2.0°).
  • Efficient heat dissipation with the guarantee of hermeticity.

Copper Heat Sink Header

Copper Heat Sink Header

Copper Slug Header

Copper Slug Header

Product performance

Thermal Simulation shows Copper Heatsink to have superior cooling ability. Cu Heatsink can lower chip temperature by about 20°C.

Cu Heatsink can lower down chip temperature by 21°C.

Simulation graphics 82.4°C.

Experiment environment : TA(Ambient Temperature) = 25.0 °C, PH(Power Heat)= 6.0 W:

Simulation graphics 61.1°C.

Experiment environment : TA(Ambient Temperature) = 25.0 °C, PH(Power Heat)= 6.0 W:

TO simulation graphics 128.3°C.

Experiment environment : TA(Ambient Temperature) = 70.0 °C, PH(Power Heat)= 6.0 W:

TO simulation graphics 106.6°C.

Experiment environment : TA(Ambient Temperature) = 70.0 °C, PH(Power Heat)= 6.0 W:

Cu Heatsink can lower down chip temperature by 22°C

TO simulation graphics 56.4°C.

Experiment environment : TA(Ambient Temperature) = 25.0 °C, PH(Power Heat)= 3.0 W:

TO simulation graphics 34.6°C.

Experiment environment : TA(Ambient Temperature) = 25.0 °C, PH(Power Heat)= 3.0 W:

 

TO simulation graphics 136.4°C.

Experiment environment : TA(Ambient Temperature) = 105.0 °C, PH(Power Heat)= 3.0 W:

TO simulation graphics 114.6°C.

Experiment environment : TA(Ambient Temperature) = 105.0 °C, PH(Power Heat)= 3.0 W: