Glass Panels
Aiming to advance Moore's Law, SCHOTT Glass Panels push the boundaries of advanced heterogeneous packaging and high-density interconnect technologies. Paving the way for next generation high-performance computers, Artificial Intelligence and other sophisticated microelectronic devices, SCHOTTs highly precise panels seamlessly enable the extremely tight assembly of semiconductor ICs, radio frequency emitters, antennas, sensors, and other microelectronic devices. They excel in through glass via (TGV) formation and subsequent high-performance metallization.
Superior properties for advanced semiconductor packaging
SCHOTT Glass Panels provide a scalable and cost-effective solution for high-performance IC substrates and interposers. Available in various sizes and thicknesses, they offer both high and low thermal expansion options. Their beneficial electrical properties in the GHz range, high stiffness, and low surface roughness support advanced packaging needs, while high optical transmittance facilitates sophisticated co-packaged optics expected to come in future.
SCHOTT Semicon next: Where semiconductor challenges meet material innovation
As scaling becomes increasingly complex, new materials and advanced packaging approaches are moving into focus.
Designed as a dedicated knowledge hub for semiconductor innovation, SCHOTT Semicon next brings together expert insights on glass-enabled performance, efficiency, and advanced integration.
Explore on-demand sessions, technical whitepapers, and industry perspectives from SCHOTT experts.