Three circular SCHOTT glass wafers on a blue background

Substrates and Wafers

Over several decades, SCHOTT has built a large amount of experience in the field of substrates and glass wafers, serving the imaging, sensing, semiconductor, medical and biotechnology industries. Our experts also offer valuable help to customers in developing solutions closely tailored to their needs.
Four clear circular samples of SCHOTT MEMpax® thin borosilicate glass on a black background

Tight geometric tolerances, no matter the thickness

SCHOTT’s unique melting technologies and advanced processing methods mean products can be manufactured across a wide range of thicknesses – from 0.03 mm to 3 mm, with custom thicknesses available on request. In all cases, tight geometric tolerances mean performance is always efficient and reliable, even in challenging application environments.

Four clear samples of SCHOTT Cut-to-Size Substrates in different shapes on a dark background

Multiple glass types with a broad CTE range

SCHOTT’s commitment to versatility is demonstrated by the number of different glass types available for its wafer and substrate products, offering coefficients of thermal expansion (CTEs) ranging from 3.2 x 10-6 / ºC to 9.4 x 10-6 / ºC. Our down-draw production process results in an excellent fire-polished surface without the need for further polishing.

Three circular SCHOTT glass wafers on a blue background

Product variants

SCHOTT offers two different variants depending on customer needs: polished and unpolished. Unpolished substrates and wafers are available in a broad range of glass types, with a wide choice of thicknesses, tight geometrical tolerances, and excellent transmission, while the polished option adds exceptional TTV and flatness.

More about variants

We are certified

We are both ISO 9001 and 14001 certified. The production of our substrates and wafers is constantly monitored at all stages, and they also comply with EU-RoHS and EU-REACH standards.

Dr. Michael Töpper from the Business Development team at Fraunhofer Institute for Reliability and Microintegration (IZM)
News & Innovation stories

“Glass has excellent dielectric properties”

Dr. Michael Töpper from the IZM explains why glass is the ideal material for the semiconductor industry.

Read More
Diagram of a computer chip with 3D glass packaging

The end of Moore's law?

With the number of transistors per unit area doubling about every 24 months, traditional chip architectures are reaching their technological limits. Find out how 3D chip packages using glass could push the sector forwards.

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Man in a car looking at a smartphone with face-mapping technology

A smart future for mobiles

Discover how thin glass from SCHOTT is helping to add 3D imaging and sensing to smartphones.

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Fairs and Events

Meet our experts between 1 - 3 September 2021 in Shenzhen, China where they will be exhibiting at the China International Optoelectronic Exposition (CIOE). They are looking forward to meeting you and having some vibrant discussions.

Next Event


1 - 3

China International Optoelectronic Exposition

Shenzhen, China

Want to know more? Let’s talk

Whether you need more information, samples, a quote, or advice for a project, we would be delighted to talk to you.

Get in touch
Man in glasses in business office on phone while working on laptop