Substrates and Wafers
Over several decades, SCHOTT has built a large amount of experience in the field of substrates and glass wafers, serving the imaging, sensing, semiconductor, medical and biotechnology industries. Our experts also offer valuable help to customers in developing solutions closely tailored to their needs.
Tight geometric tolerances, no matter the thickness
SCHOTT’s unique melting technologies and advanced processing methods mean products can be manufactured across a wide range of thicknesses – from 0.03 mm to 3 mm, with custom thicknesses available on request. In all cases, tight geometric tolerances mean performance is always efficient and reliable, even in challenging application environments.
Multiple glass types with a broad CTE range
SCHOTT’s commitment to versatility is demonstrated by the number of different glass types available for its wafer and substrate products, offering coefficients of thermal expansion (CTEs) ranging from 3.2 x 10-6 / ºC to 9.4 x 10-6 / ºC. Our down-draw production process results in an excellent fire-polished surface without the need for further polishing.
Wide choice of options delivers the ideal solution
SCHOTT’s glass substrate and wafer range is built on technical excellence proven in rigorous tests. We have access to a broad range of materials, as well as advanced processing and manufacturing technologies, resulting in high-performance wafers and substrates with a wide spectrum of CTEs and the option of achieving TTVs of less than 0.6 µm. Further benefits include a range of thicknesses, tight geometric and surface tolerances, and semiconductor-ready laser marking and packaging if required.
Tight geometrical properties
Including tight thickness tolerance, low TTV and low warp.
Large choice of materials
Vast range of glass types offering a wide choice of technical properties.
Superior fire-polished surface
Our unique down-draw manufacturing process generates a high-quality fire-polished surface.
Exceptionally low wafer flatness
SCHOTT’s grinding and polishing technologies achieve superior low wafer flatness.
Broad thickness range
With thicknesses from 0.03 to 3 mm, engineers and designers have flexible options.
Cleanroom-grade processing
Our cleaning and packaging processes strictly adhere to semiconductor standards.
