Three circular SCHOTT glass wafers on a blue background

Substrates and Wafers

Over several decades, SCHOTT has built a large amount of experience in the field of substrates and glass wafers, serving the imaging, sensing, semiconductor, medical and biotechnology industries. Our experts also offer valuable help to customers in developing solutions closely tailored to their needs.

Four clear circular samples of SCHOTT MEMpax® thin borosilicate glass on a black background

Tight geometric tolerances, no matter the thickness

SCHOTT’s unique melting technologies and advanced processing methods mean products can be manufactured across a wide range of thicknesses – from 0.03 mm to 3 mm, with custom thicknesses available on request. In all cases, tight geometric tolerances mean performance is always efficient and reliable, even in challenging application environments.

Four clear samples of SCHOTT Cut-to-Size Substrates in different shapes on a dark background

Multiple glass types with a broad CTE range

SCHOTT’s commitment to versatility is demonstrated by the number of different glass types available for its wafer and substrate products, offering coefficients of thermal expansion (CTEs) ranging from 3.2 x 10-6 / ºC to 9.4 x 10-6 / ºC. Our down-draw production process results in an excellent fire-polished surface without the need for further polishing.

Product variants

SCHOTT offers two different variants depending on customer needs: polished and unpolished. Unpolished substrates and wafers are available in a broad range of glass types, with a wide choice of thicknesses, tight geometrical tolerances, and excellent transmission, while the polished option adds exceptional TTV and flatness.

More about variants

Wide choice of options delivers the ideal solution

SCHOTT’s glass substrate and wafer range is built on technical excellence proven in rigorous tests. We have access to a broad range of materials, as well as advanced processing and manufacturing technologies, resulting in high-performance wafers and substrates with a wide spectrum of CTEs and the option of achieving TTVs of less than 0.6 µm. Further benefits include a range of thicknesses, tight geometric and surface tolerances, and semiconductor-ready laser marking and packaging if required.