FLEXINITY ® connectWith FLEXINITY® connect, SCHOTT is expanding its high precision structured glass portfolio FLEXINITY® towards very small holes in combination with highest amounts of structures - tailored for advanced packaging in the semiconductor industry.
Meeting tomorrow’s demands for the advanced packaging industry today
The world’s technology is changing at a rate that’s never been seen before. Devices are getting smaller, communication is getting quicker, and electronics systems are becoming more complex. To keep pace with this rapid development, SCHOTT has created a high-performance alternative to silicon and copper clad laminate.
FLEXINITY® connect offers increased design flexibility alongside the highest I/O counts and the lowest electrical resistance for advanced packaging. This exciting structured glass substrate provides manufacturers with a new-found level of freedom, giving them the opportunity to push their technology even further.
The semiconductor industry currently uses Printed Circuit Boards (PCB) and silicon interposers for advanced chip packaging solutions, but structured glass substrates have been considered a breakthrough technology for many years. Driven by the need for increased performance in data centers, 5G, and autonomous driving, laser structured glass is ideal for electronic applications.
Why is structured glass ideal?While silicon and copper clad laminate solutions are expensive and have low electrical performance and limited reliability, the smooth surface and excellent coefficient of thermal expansion (CTE) match of structured glass provides a high-performance alternative to traditional materials. This makes it the most suitable material for advanced packaging.
Why should you use structured glass?
Glass Circuit Boards not only reduce size and improve performance, they also enable embedding when compared to conventional interposer packages. Thanks to the structured glass core, new opportunities can be opened in the semiconductor chip packaging industry.
The key differentiating factors are:
- Compared to silicon, glass can improve signal performance and reduce signal latency, leading to increased microchip speeds.
- Due to lower processing costs, all passive devices can be placed on the structured
- The capability of embedding allows all passive device parts to be placed close to the semiconductor, resulting in reduced power loss and minimal electrical noise.
- Glass reduces the size and thermal load of the package to improve overall performance.
Conventional Interposer1) package vs. glass core package