Substrates and Wafers
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Technical Details of Substrates and Wafers

The range of SCHOTT Substrates and Wafers includes a huge portfolio of glass types, with a broad range of CTEs, thicknesses and geometrical properties. With SCHOTT, you also receive access to a global R&D network, as well as superior processing technologies and expert support from development to launch.

High precision for a vast range of requirements

CTEs to suit your needs

SCHOTT offers a range of glass wafers for a wide variety of applications, and we work closely with customers to find the ideal solution. With a broad spectrum of CTEs, from 3.2 x 10⁻⁶/ ºC – 9.4 x 10⁻⁶/ ºC, our wafers are able to meet highly precise customer requirements.

Polishing taken to the next level

SCHOTT products benefit from state-of-the-art manufacturing methods. A pristine surface can be created from the unique down-draw process. Alternatively, the innovative surface treatment processing method helps to create very low TTVs, with both methods resulting in a supremely smooth surface.

Lowest levels of flatness and TTV

When the highest levels of precision are required, SCHOTT wafers exceed the demanding standards of the semiconductor industry. Exceptionally low levels of flatness and total thickness variation (TTV) can be achieved, with values as low as 0.6 µm.

Packaged up for semiconductors

SCHOTT provides expert support to customers, from the first innovation and development stages through to mass production. We also offer laser marking according to individual semiconductor or customer requirement.
Available materials

Available materials

SCHOTT Substrates and Wafers are available in the following materials:

  • FLEXINITY®
  • D 263®T eco
  • AF 32®eco
  • MEMpax®
  • BOROFLOAT®
  • SCHOTT RealView®
  • B 270®
  • AS 87 eco
  • FOTURAN® II

To find out more, please see the related products on the overview page.

Want to know more? Let’s talk

Whether you need more information, samples, a quote, or advice for a project, we would be delighted to talk to you.

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