HermeS®
Ultra-reliable, chip-size MEMS packaging
From macro to micro, HermeS® TGV wafers provide electronic packaging for MEMS devices, including miniaturized applications in large-scale industrial and automotive sensors and medical equipment, in which medical electronics can be packaged to withstand body fluids and sterilization cycles over long periods of time.
Advantages over TSV and ceramic packaging
As glass has higher resistance properties, HermeS® TGV wafers can significantly extend the long-term efficiency of MEMS devices. Excellent RF performance and optical transparency are further advantages, while the superior miniaturization capabilities allow a 80% smaller foot print over ceramic packaging, as the TGVs can be directly attached to the silicon MEMS.
High-level sealing
SCHOTT’s leading glass-to-metal sealing technology keeps our TGV wafer electronic packaging totally gas-tight, protecting the passage of electronic signals and electrical power through a MEMS device.
EXPLORE MATERIAL PROPERTIES IN DETAIL
