Hermetic Sensor Packaging

Sensor applications come with a multifaceted set of requirements for successful operation. With a vast technology portfolio, SCHOTT has built a reputation as the partner of choice for fulfilling the most challenging requirements.

Harsh-Environment Sensor Packaging Harsh-Environment Sensor Packaging Harsh-Environment Sensor Packaging Harsh-Environment Sensor Packaging Harsh-Environment Sensor Packaging Harsh-Environment Sensor Packaging Harsh-Environment Sensor Packaging Harsh-Environment Sensor Packaging Harsh-Environment Sensor Packaging Harsh-Environment Sensor Packaging
  • Harsh-Environment Sensor Packaging
  • Harsh-Environment Sensor Packaging
  • Harsh-Environment Sensor Packaging
  • Harsh-Environment Sensor Packaging
  • Harsh-Environment Sensor Packaging
  • Harsh-Environment Sensor Packaging
  • Harsh-Environment Sensor Packaging
  • Harsh-Environment Sensor Packaging
  • Harsh-Environment Sensor Packaging
  • Harsh-Environment Sensor Packaging
Harsh-Environment Sensor Packaging

Feedthroughs and packaging components from SCHOTT are well-suited for extreme operating environments often found in safety- or performance-critical automotive, aerospace, and industrial settings.

APPLICATIONS

  • Temperature sensors
  • Pressure sensors
  • Humidity sensors
  • Inertial measurement sensors
  • Gas sensors
  • Fluid sensors
  • Flow sensor

 

YOUR ADVANTAGES

With decades of expertise, SCHOTT is one of the few manufacturers that meets challenging quality and supply requirements for harsh-environment sensor components:

  • Superior reliability: up to 2,000 bar pressure resistance, 1000°C temperature stability, and up to 30 years lifetime depending on the design.
  • Fully custom-designed single- or multi-pin feedthroughs and packages.
  • Consistently stable lot-to-lot quality at high volumes.
 
 
Optical Sensor Packaging Optical Sensor Packaging Optical Sensor Packaging Optical Sensor Packaging Optical Sensor Packaging
  • Optical Sensor Packaging
  • Optical Sensor Packaging
  • Optical Sensor Packaging
  • Optical Sensor Packaging
  • Optical Sensor Packaging
Optical Sensor Packaging

SCHOTT offers a range of hermetic packages designed to provide reliable protection and enable superior light beam input and output for optical sensors and MEMS components. Our portfolio includes:

  • Custom through-hole or SMD packages
  • Standard and custom high-performance optical lenses or window caps
  • Ultra-miniature 'all-glass' WLCSP options offered 
  • Standard transistor outline (TO) packages with matching caps/lenses (TO8, TO38, TO39, TO41, TO46, TO56)

APPLICATIONS

  • UV/VIS/IR sensor packaging
  • Laser/photo diode packaging, e.g. Datacom, LiDAR
  • MEMS mirror packaging
  • LED packaging

 

YOUR ADVANTAGES

  • Superior product reliability and precision based on more than 50 years of research and applied optoelectronic design and manufacturing expertise.
  • First-class technical and application support from our dedicated optoelectronics specialists.
Wafer Level Chip Scale Sensor Packaging Wafer Level Chip Scale Sensor Packaging Wafer Level Chip Scale Sensor Packaging
  • Wafer Level Chip Scale Sensor Packaging
  • Wafer Level Chip Scale Sensor Packaging
  • Wafer Level Chip Scale Sensor Packaging
Wafer Level Chip Scale Sensor Packaging

State-of-the-art Primoceler™ glass micro bonding technology by SCHOTT Primoceler Oy enables the production of ultra-miniature, ultra-reliable wireless sensors and MEMS. The laser-based process allows for hermetic sealing of two or more glass wafers to produce chip-size 'all-glass' packages. Performed at room temperature and without the use of any additives, it enables the encapsulation of highly heat-sensitive electronics.

APPLICATIONS

While Primoceler™ packages are often designed with through-glass vias for signal transmission using SCHOTT HermeS® wafers, the excellent RF-transmission properties of glass also open the possibility for fully wireless device assemblies for:

  • Medical devices and implants
  • MEMS sensors
  • Flow cells
  • Aerospace
  • High-temperature applications
  • Micro-optics

 

YOUR ADVANTAGES

    • Ultra-reliable: no adhesives, no outgassing, high hermeticity.
    • Ultra-miniature: room-temperature process and a minimal heat-affected zone enables thinner materials and smaller dimensions.
    • Highly efficient: reliability and miniaturization leads to a high yield with more devices per wafer. The fast one-step process also uses no consumables.
    Integrated Sensor Packaging Integrated Sensor Packaging Integrated Sensor Packaging Integrated Sensor Packaging Integrated Sensor Packaging Integrated Sensor Packaging Integrated Sensor Packaging Integrated Sensor Packaging Integrated Sensor Packaging
    • Integrated Sensor Packaging
    • Integrated Sensor Packaging
    • Integrated Sensor Packaging
    • Integrated Sensor Packaging
    • Integrated Sensor Packaging
    • Integrated Sensor Packaging
    • Integrated Sensor Packaging
    • Integrated Sensor Packaging
    • Integrated Sensor Packaging
    Integrated Sensor Packaging

    SCHOTT’s wide-ranging competencies enable significant design freedom for sensor manufacturers. This includes the development of high I/O count packages as well as multiple electrical and optical interfaces using microelectronic packages. Complete electrical assemblies, such as sensitive measurement and control electronics, can be encapsulated.

    PORTFOLIO

    • Multi-pin MCM or IC packages
    • Power electronics packages with high thermal conductivity
    • Microwave / RF packages
    • Amplifier packages

     

    YOUR ADVANTAGES

    • First-class product quality: SCHOTT’s hermetic microelectronic sensor packages meet the highest performance and lifetime expectations, even in extreme pressure, vibration, and high-temperature conditions.
    • Unmatched technical design support and consultation: we cater to customer-specific interface needs, optimized to fulfill electrical, mechanical, optical, and thermal requirements.

    Want to know more? Let’s talk

    Whether you need more information, samples, a quote, or advice for a project, I would be delighted to talk to you.

    Get in touch
    Mark Stronczek, Sensor Sales
    Mark Stronczek

    Sensor Sales