Glass Micro Bonding by SCHOTT Primoceler
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A miniaturized retinal implant shown as an example of wafer-level micro-optics

Glass Micro Bonding by SCHOTT Primoceler

Glass Micro Bonding is a revolutionary laser-based process that enables ultra-miniaturized hermetic packaging for highly sensitive electronics in demanding applications. The technology is pushing innovations forward in medical implants, aerospace, MEMS, and micro-optics.
Rendering showing an all-glass hermetic package made with SCHOTT Primoceler Glass Micro Bonding technology

Ultra reliable hermetic sealing

Glass Micro Bonding is an innovative process that opens new doors for the wafer-scale sealing of electronics with all-glass hermetic electronic packages. The hermetic seal is formed using an extremely precise laser to fuse glass-to-glass by melting only the cross section where the glass meets – an area of just a few microns – while leaving all other surfaces untouched.

A comparison showing the extreme miniaturization of a pencil compared to a component sealed with SCHOTT Primoceler Glass Micro Bonding

Ultra miniature wafer-level chip scale packaging

Components sealed with Glass Micro Bonding can be as small as a few cubic millimeters. The technique has flexible implementation possibilities and can be performed on a chip-scale all the way up to wafers as large as 12 inches, making it simple and cost-effective to scale up for high-volume manufacturing.

Supporting innovation with next-generation hermetic sealing

Glass Micro Bonding is a revolutionary addition to SCHOTT’s portfolio of hermetic sealing methodologies. If reliable encapsulation, biocompatibility, miniaturization, or production efficiency are on your requirements checklist, Glass Micro Bonding could be a fit for your application. SCHOTT offers a collaborative development process to help support the creation of expertly engineered finished customer components.

Fully hermetic
Fully hermetic
As the leader in hermetic glass-to-metal and glass-to-glass sealing SCHOTT has unmatched expertise in manufacturing truly reliable vacuum-sealed assemblies.
Unmatched miniaturization
Unmatched miniaturization
Direct glass-to-glass wafer bonding enables highly compact designs with thinner materials and minimal spacing between layers.
No adhesives or additives
No adhesives or additives
Glass Micro Bonding doesn’t require additives or adhesives to complete the sealing process, helping reduce bulk and complexity.
No environmental heat
No environmental heat
Heat-sensitive electronics can be hermetically encapsulated thanks to an extremely small and precise heat-affected zone of just a few microns.
Biocompatibile options
Biocompatibile options
Glass Micro Bonding can be performed with glass types that offer excellent biocompatibility – a distinct advantage in medical applications.
High yield and replicability
High yield and replicability
Glass Micro Bonding is a highly efficient wafer-level process. Benefits of this include high yield, many devices per wafer, and no consumables required.

We are certified

SCHOTT Primoceler’s manufacturing processes are constantly optimized to allow efficient production and component traceability. Our entire staff participates in further developing the ISO 9001 quality system on a continuous basis.

SCHOTT Primoceler all-glass packaging for high-reliability applications

Related products

SCHOTT Primoceler’s laser bonding technology is suitable for most glass types, including SCHOTT BOROFLOAT®, SCHOTT D 263®, SCHOTT AF 32® eco, SCHOTT MEMpax® Ultra-Thin Borosilicate Glass. Most glass substrates can be supplied with SCHOTT HermeS® TGV (Through Glass Via) technology or as SCHOTT FLEXINITY™.
Customized Packaging for Medical
Customized Packaging for Medical
Surgical devices and active medical implants come with extremely stringent and demanding requirements for their electronic components. Custom-designed feedthroughs, connectors, and packaging technology from SCHOTT can enable next-level reliability and completely new electronic device designs.
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HermeS®
HermeS®
HermeS® glass wafer substrates with hermetically sealed, solid through-glass vias (TGV) enable ultra-miniaturized, fully hermetic sensors and MEMS devices in Wafer Level Chip Size (WLCSP). The extremely fine-pitched vias enable reliable conduction of electrical signals and power into and out of the MEMS device.
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BOROFLOAT®
BOROFLOAT®
Tough, light and versatile, BOROFLOAT® is coveted by technology companies and scientific institutes for its superb technical capabilities. Excellent transparency and thermal and chemical resistance make it ideal for use in automotive applications, digital projection, inspection windows and much more.
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AF32® eco
AF32® eco
With a unique range of properties, as well as semiconductor process compatibility, AF 32® eco offers a flexible option for designers. This alkali-free glass is produced using SCHOTT’s unique down-draw process, which results in a broad thickness range, excellent transmittance and a superior surface quality.
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MEMpax®
MEMpax®
MEMpax® is an extremely thin, smooth borosilicate glass with real versatility. While it shares similar chemical and physical characteristics to SCHOTT’s world-renowned BOROFLOAT®, it opens up many new areas of potential application thanks to its lower thickness and fire-polished surface.
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FLEXINITY®
FLEXINITY®
SCHOTT’s structured glass substrates and wafers deliver an outstanding combination of properties for applications such as sensing, optoelectronics and diagnostics. FLEXINITY® provides manufacturers with the ability to develop new innovations that enhance function, reduce costs and increase effectiveness.
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Microelectronic Packaging
Microelectronic Packaging
Often referred to as hybrid packages, multi-chip module housings, or IC packages, SCHOTT’s hermetic microelectronic packages and multilayer ceramic substrates protect sensitive electrical assemblies and components in ultra-tough operating conditions. They simultaneously enable reliable power and signal transmission.
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Hermetic Sensor Packaging
Hermetic Sensor Packaging
SCHOTT’s sensor packaging enables reliable protection and functionality of sensor electronics, especially in harsh-environment, performance-critical applications. SCHOTT offers a broad portfolio of sensor housings using advanced hermetic sealing technologies to guard even the most sensitive electronics.
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Solidur®
Solidur®
Our ultra-robust High Brightness Solidur® LEDs deliver unparalleled reliability in conditions previously unsupported by conventional LEDs. This includes safety-critical medical, dental, UVB/UVC, and other harsh-environment applications in which conventional LEDs and other light sources are unable to survive.
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Rendering of all-glass retinal implant package hermetically sealed with SCHOTT Primoceler Glass Micro Bonding
News & Innovation stories

Enabling Vision Restoration with Glass Encapsulation

NanoRetina announces successful preliminary results for its NR600 Artificial Retina Device using SCHOTT Primoceler’s glass laser bonding technology.

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Cross section rendering of an implantable device hermetically sealed with SCHOTT Primoceler Glass Micro Bonding

Implantable Technology Breakthrough

SCHOTT Primoceler’s bonding process was used in a collaboration with Geissler Companies and IRD Glass to help develop of safer, non-magnetic Implantable devices that are safely encapsulated in miniature all-glass packages.

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Fairs and Events

Meet our experts in Nuremberg on 10 – 12 May 2022 at SENSOR + TEST, a leading forum for sensors, measuring and testing technologies worldwide. They are looking forward to meeting you and having some vibrant discussions.

Next Event

MAY

10 - 12

SENSOR + TEST

Nuremberg, Germany

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Want to know more? Let's talk

Whether you need more information, samples, a quote, or advice for a project, I would be delighted to talk to you.

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