Glass Panel
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Glass Panels

Aiming to advance Moore's Law, SCHOTT Glass Panels push the boundaries of advanced heterogeneous packaging and high-density interconnect technologies. Paving the way for next generation high-performance computers, Artificial Intelligence and other sophisticated microelectronic devices, SCHOTTs highly precise panels seamlessly enable the extremely tight assembly of semiconductor ICs, radio frequency emitters, antennas, sensors, and other microelectronic devices. They excel in through glass via (TGV) formation and subsequent high-performance metallization.

Corners of SCHOTT Glass Panels on dark background

Variable and mo(o)re

SCHOTT Glass Panels offer unparalleled versatility, meeting semiconductor industry quality standards. Available in various glass types with a wide range of properties and thicknesses, all featuring outstanding bulk & surface quality, SCHOTT Glass Panels can be precisely tailored to meet an unlimited number of advanced multiple IC devices.
Three SCHOTT Glass Panels stacked up on dark background

Ready for precise structuring and metallization

SCHOTT Glass Panels facilitate critical processing steps in manufacturing microelectronic's packaging components. They offer proven capability for ultra-fine high-density TGV laser structuring, which can be combined with large openings for embedding active or passive components. The glass’s superior surface quality ensures exceptional metallization performance.

Superior properties for advanced semiconductor packaging

SCHOTT Glass Panels provide a scalable and cost-effective solution for high-performance IC substrates and interposers. Available in various sizes and thicknesses, they offer both high and low thermal expansion options. Their beneficial electrical properties in the GHz range, high stiffness, and low surface roughness support advanced packaging needs, while high optical transmittance facilitates sophisticated co-packaged optics expected to come in future.

    Huge versatility
    Huge versatility
    Glass panels can be offered from different glass types with different CTE’s for optimal package performance.
    Various formats
    Various formats
    Available in several formats, comprising panels 510 x 515 mm in various thicknesses.
    High precision
    High precision
    Exhibiting high geometrical accuracy and surface quality, equipped with high-quality processed edges.
    Structuring-ready
    Structuring-ready
    Optimized for high-density TGV and embedding of active and passive components.
    High stiffness
    High stiffness
    Reduces package warp, maintaining the integrity and performance of larger chips and packaging units.
    Excellent dielectric properties
    Excellent dielectric properties
    Low GHz dielectrics enable efficient antennas and packages with extremely low signal delay.

    We are certified

    SCHOTT is both ISO 9001 and 14001 certified. The production of Glass Panels is constantly monitored at all stages and all our glass is subjected to stringent quality inspection before shipping. It also complies with EU-RoHS and EU-REACH

    Related products

    SCHOTT has a number of other products with similar properties to SCHOTT Glass Panels. Discover which one answers your challenge.
      FLEXINITY® connect
      FLEXINITY® connect
      FLEXINITY® connect offers a high-performance alternative to traditional materials such as silicon and copper-clad laminates for advanced packaging substrates. The combination of perfectly suited materials with exceptionally accurate dimensions lifts FLEXINITY® connect to the next level of semiconductor packaging.
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      Whether you need more information, samples, a quote, or advice for a project, we would be delighted to talk to you.

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