MEMpax®
Slimline features and surface appeal
SCHOTT MEMpax® extends the world’s renowned BOROFLOAT® borosilicate glass thickness portfolio in extremely low thicknesses, from 0.07-0.55 mm. It also benefits from a pristine, fire-polished surface, removing the need for grinding and polishing, and can be used anywhere that extremely thin borosilicate glasses are required, such as MEMS and biotechnology applications.
Outstandingly versatile
A combination of unique thicknesses and outstanding properties expand the potential of MEMpax®. Its CTE (coefficient of thermal expansion) corresponds to a silicon wafer, which makes it ideal for wafer applications in anodic and other bonding processes. Low autofluorescence, high UV transmission, and electrically non-conductive properties further widen its potential.
Unique portfolio of properties
MEMpax® enables a range of shapes and sizes to be combined with unrivalled low thicknesses, while very high chemical resistance makes this high purity glass extremely durable during processing. Its CTE makes it highly compatible with silicon in bonding processes, its high (UV) transmission allows fast debonding, and it maintains non-electrical conductivity even at high temperatures.
