Range of SCHOTT’s hermetic microelectronic packages

Microelectronic Packaging

Often referred to as hybrid packages, multi-chip module housings, or IC packages, SCHOTT’s hermetic microelectronic packages protect sensitive electrical assemblies and components in ultra-tough operating conditions. They simultaneously enable reliable power and signal transmission.
Woman sitting in front of a machine and inspecting a golden microelectronic package

First-class quality and reliability

Hermetic packages from SCHOTT meet the latest and toughest specifications, including extreme performance and lifetime expectations where other components fall short. The high quality of our microelectronic packages offers reliability in high pressure, vibration, and temperature conditions, as well as optimal processability for our customers' production lines.

A young men and a women discussing about a hermetic package of SCHOTT in front of a table.

Innovation and design support for next-level performance

Custom-designed for individual requirements, SCHOTT products are fit to meet the challenges of today and tomorrow. Our complete technology toolbox caters to special interface needs, miniaturization, high I/O count form factors, integrated and thermal management solutions, high-speed products, and lightweight, non-magnetic material requirements.

A golden hermetic RF package on a grey background

Product variants

Since SCHOTT is an experienced manufacturer of hermetic packages, we can offer fully custom-made components that fulfill even the most difficult requirements. The broad portfolio enables our customers to find a perfect design for their individual applications.

More about variants
A grey hermetic package made of titanium on a grey background
A golden hermetic power package with some pins on a grey background
A golden hermetic lightweight package on a grey background

We are certified

All our production facilities are ISO 9001 certified. In addition, our products comply with the International Telcordia Specifications, are ROHS compatible and comply with MIL PRF-38534 and MIL STD-883.

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News & Innovation stories

Because every gram counts

In today’s fast-paced commercial aerospace market, companies need materials that are both lightweight and durable enough to withstand hostile, demanding environments. Therefore, we have launched our new lightweight microelectronic packages for aerospacet that weigh up to two-thirds less than conventional microelectronic packages made of kovar.

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Want to know more? Let's talk

Whether you need more information, samples, a quote, or advice for a project, I would be delighted to talk to you.

Contact us
Georg Mittermeier, Technical Sales Manager
Georg Mittermeier

Technical Sales Manager