SCHOTT® Cavity Cap

SCHOTT® Cavity Cap offers an impressive range of technical standards thanks to high-end microscale structuring, the latest bonding technology, and fine-tuned dicing. A key component for miniaturized systems, its customization potential makes any shape possible, offering a highly versatile packaging solution.

Create it your way

SCHOTT® Cavity Cap is available in a wide range of glass types and a broad variety of CTEs depending on submount material. As well as diced caps, we can also provide cap wafers, both with the option of a top window coating to reduce light-reflection losses.

High light transmission

Thanks to the use of SCHOTT’s acclaimed thin glasses, the top window of SCHOTT® Cavity Cap offers light transmission up to 91.7% for wavelengths in the UV to near-IR range.

Highly accurate geometry

SCHOTT® Cavity Cap is available in a wide range of total heights, typically from 1-2 mm, but this can be halved or doubled depending on component combinations. Underlining the product’s impressive versatility, spacer height can range between 0.2-3.3 mm, while dam widths are available down to 0.5 mm.

Outstanding reliability

The outstanding inner wall quality of FLEXINITY® combined with carefully selected bonding solutions and optimum cap dicing parameter settings results in SCHOTT® Cavity Cap offering high mechanical strength and a lack of loose particle formation during the closure process and application.

Technical details

Bonding

SCHOTT® Cavity Cap Materials

Technical Details for SCHOTT

Material	D 263® Family	MEMpax®	AF 32® eco	BOROFLOAT® 33
CTE (ppm/K)	7.2	3.3	3.2	3.3

Technical Data – Window
Luminous transmittance τvD65 at 0.3 mm	~ 91.7 %
Thickness (h1)	0.1 – 1.1 mm
AR coating (single-side/double-side)	on demand

Technical Data – Spacer
Spacer height (h2)	0.2 – 3.3 mm
Opening size (a, b)	variable; min. 0.3 mm
Opening tolerances	< 20 μm (equiv. ± 10 μm)
Dam width (d1, d2)	down to 0.5 mm

Technical Data – Cap
Cap size (L, W)	variable; min. 3 x 3 mm
Cap size tolerance	± 100 μm
Cap height (h1+h2)	min. 0.3 mm
Chipping (inner edge)	< 10 μm
Chipping (diced outer edge)	< 100 μm

SCHOTT® Cavity Cap-Graphic-Dimensions

Bonding

Wafer-level hermetic laser bonding: high level of hermeticity.
Minimal heat load: heat-affected zone of just a few micrometers.
Additive-free: no adhesives or extra materials required.