Microelectronic Packaging

SCHOTT draws on more than 80 years of experience in developing and manufacturing hermetically-sealed packages and is the only vendor in Europe that offers a complete portfolio of hermetic packaging technologies. By covering all essential and quality-critical processes in-house, we can offer fully custom-made components that fulfill even the most difficult requirements.

Outstanding properties and a wide range of choices

True reliability

As a dedicated supplier with decades of experience in safety-critical applications, SCHOTT manufactures products that meet the highest performance and longevity expectations – even in working environments with extreme pressure, vibration, and temperatures of 175°C (347°F).

Big in miniaturization

Glass-to-metal sealing can enable the production of miniature 3D interconnect solutions, paving the way for high-density input/output capability in small-form-factor hermetic packages with high I/O count.

Superior thermal management

SCHOTT Microelectronic Packaging offers extraordinary thermal conductivity and powerful temperature resistance beyond 300°C, making them well-suited for handling the heat in high-power applications.

High-speed products. Integrated solutions

Catering to high-speed requirements, we offer coaxial high-frequency ports, as well as integrated features, such as connectors or circuits. This increases efficiency for customers, who can remove these steps from their own production processes.


Glass-to-Metal Sealing – SCHOTT GTMS

  • Glass-to-metal sealed (GTMS) microelectronic packages offer excellent performance when it comes to effectively protecting electronic systems, defending sensitive components against harsh environmental conditions, and supporting efficient transmission of optical signals.

  • SCHOTT’s GTMS packages are extremely effective at protecting a comprehensive range of components – electronic, opto-electronic and microelectronic – in diverse industrial and technical fields, including microwave packaging, sensor and medical technology, and power electronics.

  • Efficient transmission of optical signals. Protection for electronic, opto-electronic, and microelectronic parts. Diverse uses from sensor technology to power electronics.
    Detailed information about glass-to-metal sealing technology can be found here.

Laser Welding

  • Laser welding is an innovative process that opens new possibilities for electrical and mechanical connection of components using the same or different material compositions.

  • With this approach, the hermetic seal is formed at room temperature, which protects the electronics from heat damage.

  • Laser welding is a flexible technique with multiple implementation possibilities. It can be performed at the component level all the way up to batch processing scales, making it easy and cost-effective to scale up for high-volume manufacturing.

  • Because laser welding uses corrosion-resistant material, it is especially suitable for medical applications such as medical implants, batteries, and endoscopes.

Brazing and Soldering

  • Brazing and soldering enable electrical, mechanical, and thermal connection of components using the same or different materials with similar CTEs.

  • These connection techniques work well for any application but are especially useful for challenging packages that have a large number of electrical, optical, mechanical, and thermal interfaces.

  • Metal brazing and soldering is ideal for large metal housings because it enables cost-effective manufacturing processes such as deep drawing and metal injection molding.

  • The solder cascade can be outlined at temperatures ranging from 1100°C to soft soldering temperatures of 180°C.

Technical specifications

SCHOTT Microelectronic Packaging

Technical Details


  • Hermeticity: better than 1 x 10-8 mbar x l/s

 Temperature resistance

  • Temperature resistance: > 250 °C

  • Thermal shock stability: -65 °C to 150 °C for 15 cycles

 Chemical resistance

  • Salt spray resistance: Special coatings can assure high corrosion resistance event
    after extremely aggressive 24-hour salt spray tests 

 Formats available

  • Machined types (Customized solution) 

  • Flatpacks (Stamped solutions) 

  • Plug-Ins (Stamped solutions) 

 Electrical interfaces

  • Low / high voltage feedthroughs

  • Coaxial (e.g. SMA, SMP, etc.) high frequency interfaces up to 80 GB/s

  • Lead frames / BGA / PGA / standards connector interfaces 

  • Feedthroughs for high currents 

 Optical interfaces

  • Windows 

  • Lenses 

  • Fiber optic ferrules 

 Thermal interfaces

  • (Partial) Heat sinks for dissipating heat loss from the active device (Cu-W, Mo, Al-Si, Mo-Cu) 

  • Heat spreaders


  • Standard metals
    - Kovar 
    - Stainless steel 
    - Cold rolled steel 
    - Copper
    - Molybdenum
    - Copper molybdenum
    - Copper tungsten (CuW)
    - Aluminum Silicon (AlSi)
    - Titanium and titanium alloys

  • Metals for special requirements
    - Titanium for light-weight, non-magnetic and biocompatible requirements
    - Aluminum for light-weight requirements 
    - Monel for chemically aggressive environments 

  • Available metal coatings
    - Electroless / Electrolytic Nickel 
    - Gold (Soft / Hard Au) 
    - Silver copper

 Available fusing processes

  • Glas-to-metal sealing

  • Low temperature brazing

  • High temperature brazing

  • Vacuum brazing 

  • Reflow brazing 

Want to know more? Let's talk

Whether you need more information, samples, a quote, or advice for a project, I would be delighted to talk to you.

Contact us
Georg Mittermeier, Technical Sales Manager
Georg Mittermeier

Technical Sales Manager