Range of SCHOTT’s hermetic microelectronic packages

Microelectronic Packaging

Often referred to as hybrid packages, multi-chip module housings, or IC packages, SCHOTT’s hermetic microelectronic packages protect sensitive electrical assemblies and components in ultra-tough operating conditions. They simultaneously enable reliable power and signal transmission.
Range of SCHOTT hermetic microelectronic packages on hot and cold background

First-class quality and reliability

Hermetic packages from SCHOTT meet the latest and toughest specifications, including extreme performance and lifetime expectations where other components fall short. The high quality of our microelectronic packages offers reliability in high pressure, vibration, and temperature conditions, as well as optimal processability for our customers' production lines.

Female scientist examining a multilayer ceramic substrate in a laboratory

Innovation and design support for next-level performance

Custom-designed for individual requirements, SCHOTT products are fit to meet the challenges of today and tomorrow. Our complete technology toolbox caters to special interface needs, miniaturization, high I/O count form factors, integrated and thermal management solutions, high-speed products, and lightweight, non-magnetic material requirements.

We are certified

All our production facilities are ISO 9001 certified. In addition, our products comply with the International Telcordia Specifications, are ROHS compatible and comply with MIL PRF-38534 and MIL STD-883.

Want to know more? Let's talk

Whether you need more information, samples, a quote, or advice for a project, I would be delighted to talk to you.

Contact us
Georg Mittermeier, Technical Sales Manager
Georg Mittermeier

Technical Sales Manager