Cool Copper Headers for Transistor Outline Packages

Heat removal features for high power or visible light laser applications.

About

Whenever high-power lasers are used, removal of the created heat can be an issue. Copper with its very high thermal conductivity helps with this challenge. Cool Copper header is suitable for use in Pico projectors, LiDAR, automotive headlights etc.

Product features

  • Thermally-conductive copper heat sink or slug brazed on to TO base.
  • Copper shape can be customized.
  • High transverse positioning accuracy better than ± 0.03mm (< < 2.0°).
  • Efficient heat dissipation with the guarantee of hermeticity.

Copper Heat Sink Header

Copper Heat Sink Header

Copper Slug Header

Cu Slug Header

TO 9 Header

simulation result of TO9 copper header
simulation result of TO9 copper header

TO 9 product features

  • For TO 9 configuration, thermal simulation shows thermal resistance(Rth) by average temperature of 8.14K/W (inclusive of laser, submount & header).

  • High accuracy for surface flatness control.

  • Can be used to package higher power blue/red/green/purple lasers.

  • For applications that require high power lasers like for display projectors, automotive, laser marking etc.

  • Customized versions are also possible. Customized box design for multi-laser high power package can be done based on customer’s application & design.

Cu Heatsink can lower down chip temperature by 21°C.

At ambient temperature of TA 25.0˚C,
Full CRS1010 header design has max temp of 82.4˚C
CRS1010 + Cu heatsink design has max temp of 61.1˚C 

At ambient temperature of TA 70.0˚C,
Full CRS1010 header design has max temp of 128.3˚C
CRS1010 + Cu heatsink design has max temp of 106.6˚C 

Fully CRS1010 Header

simulation result for Full CRS1010 header at ambient temperature of 25 oC

Experiment environment : TA(Ambient Temperature) = 25.0 °C, PH(Power Heat)= 6.0 W:

Cu Heatsink

simulation result for Copper heatsink header at ambient temperature of 25 oC

Experiment environment : TA(Ambient Temperature) = 25.0 °C, PH(Power Heat)= 6.0 W:

Fully CRS1010 Header

simulation result for Full CRS1010 header at ambient temperature of 70 oC

Experiment environment : TA(Ambient Temperature) = 70.0 °C, PH(Power Heat)= 6.0 W:

Cu Heatsink

: simulation result for Copper heatsink header at ambient temperature of 70 oC

Experiment environment : TA(Ambient Temperature) = 70.0 °C, PH(Power Heat)= 6.0 W:

Cu Heatsink can lower down chip temperature by 22°C.

At ambient temperature of TA 25.0˚C,
Full CRS1010 header design has max temp of 56.4˚C
CRS1010 + Cu heatsink design has max temp of 34.6˚C 

At ambient temperature of TA 105.0˚C,
Full CRS1010 header design has max temp of 136.4˚C
CRS1010 + Cu heatsink design has max temp of 114.6˚C 

Fully CRS1010 header

simulation result for Full CRS1010 header at ambient temperature of 25 oC

Experiment environment : TA(Ambient Temperature) = 25.0 °C, PH(Power Heat)= 3.0 W:

Cu Heatsink

copper header simulation-6-V2.png

Experiment environment : TA(Ambient Temperature) = 25.0 °C, PH(Power Heat)= 3.0 W:

 

Fully CRS1010 header

simulation result for Full CRS1010 header at ambient temperature of 105 oC

Experiment environment : TA(Ambient Temperature) = 105.0 °C, PH(Power Heat)= 3.0 W:

Cu Heatsink

simulation result for Copper heatsink header at ambient temperature of 105 oC

Experiment environment : TA(Ambient Temperature) = 105.0 °C, PH(Power Heat)= 3.0 W: