Substrates and Wafers
3D Imaging and Sensing
Glass wafers feature strongly in the fast-moving world of 3D Imaging and Sensing. They are effective as substrates or wafers, as well as infrared narrow band filters, with customers able to build structured light and Time of Flight (ToF) sensors, and components for stereo vision that enable face recognition and distance detection.
Glass wafers can be used in a variety of wafer-level packaging processes. For instance, a wafer with an IR-cut filter coating applied has the function of protecting an image sensor from the harmful effects of infrared radiation. Benefits of glass wafers include a close thermal match to silicon, as well as highly precise tolerances.
Glass carrier wafers for 3D IC, RF IC and fan-out packaging
SCHOTT Substrates and Wafers are ideal as highly accurate carrier materials for temporary bonding with silicon in 3D IC, RF IC and fan-out packaging. Silicon thinning and the handling of thin silicon wafers are also made possible using glass carrier wafers.
An increasing number of micro-electromechanical systems (MEMS) rely on glass wafers. Used as transparent optical windows or functional caps for hermetic housing, wafers have a similar CTE to silicon wafers, opening the possibility of anodic bonding. Low levels of dielectric loss is another advantage, with glass wafers playing an equally important role in RF and high frequency applications, as well as SAW filters that feature in 5G communications.
Modern diagnostics applications such as microfluidics rely on materials with high optical properties and low intrinsic autofluorescence to achieve the high analytical accuracy demanded by the life science and biotech fields. SCHOTT Substrates and Wafers provide outstandingly smooth, fire-polished surfaces for coatings, resulting in easier, more cost-effective processing.
As developers continue to expand the possibilities of imaging technology, SCHOTT glass wafers will become increasingly essential. As well as the outstanding quality of our products, the potential to miniaturize glass wafers to suit increasingly tiny and lightweight displays is of great use to the industry. MicroOLED, microLED and LCOS screens rely on them, while you will also find them in NTE devices, HUDs, HMDs and AR/VR devices.