Scientist inspecting a large glass wafer

Wafers

SCHOTT has been a pioneer in wafer glass technology for many years, and this experience enables us to offer innovative, lightweight and miniaturized components for MEMS packaging. Our technology is also key to the production of high quality optical components for camera imaging and WLP for optical sensors.
Through-Glass Via Wafers

SCHOTT HermeS® hermetic through-glass via (TGV) wafers offer a wafer substrate with significant reliability and miniaturization advantages over through silicon vias or ceramic packaging. With SCHOTT’s Primoceler™ glass micro bonding, it provides transparent all-glass wafer level chip-scale packaging (WL-CSP) with sealed-in electrical connections in and out of MEMS devices. As well as robust and miniature designs, our glass packaging features high thermal conductivity and excellent RF performance.

Substrate Glass for Wafer Production

Wafer production requires a very flat glass with a high, mirror-like degree of homogeneity allied to outstanding optical qualities. BOROFLOAT® 33 answers that challenge thanks to the microfloat process used in its manufacture. MEMpax® is also a borosilicate glass, but its down-draw production process enables the manufacture of UTG substrates. Both are a versatile choice even in heavy-duty environments due to their high mechanical, thermal and chemical resistance.

Lighting for Wafer Inspection

SCHOTT supports customers requiring wafer inspection to ensure systems are functioning at their optimum level. Highly advanced light guides ensure precise wafer positioning and alignment of optical paths.

Structured Wafer

SCHOTT has set a new standard for structured wafer glass substrates with FLEXINITY®, a highly versatile product portfolio that offers customers complete freedom of design. FLEXINITY® also offers impressive precision, enabling new applications and further miniaturization in IC packaging, sensors, batteries, biochips and diagnostic technology.

Unstructured Wafer

Among the huge range of SCHOTT glass products are unstructured wafer glasses such as BOROFLOAT® 33, AF32® and D263®, which are ideal for transformation applications. B270® D ultra-white glass, for instance, comes in a wide range of thicknesses and offers a fire-polished surface, making it well-suited to biotech applications. 

Ultra Thin Wafer

One advantage of SCHOTT’s ultra-thin wafer glasses is that many boast eco-friendly properties. But while they are free of refining agents such as arsenic and antimony, they don’t lack versatility. SCHOTT AS 87 eco is the world’s first high-strength ultra-thin glass available in mass volume, and is ideal for use in screen protectors or fingerprint sensor covers. D 263® T eco Thin Glass is easy to cut, process and shape, making it highly adaptable, while AF32® eco thin glass has high temperature resistance for demanding applications.

Wafer Passivation

To protect discrete semiconductor surfaces from environmental stressors such as chemicals or mechanical impact, SCHOTT offers high-purity passivation glasses that are applied to passivate the p-n-junction. High insulation properties are achieved through minimal alkali and iron content. The wide choice of top-grade glass compositions includes lead-free solutions for all common passivation applications.

Wafer-Level Chip Scale Packaging

Wafer-level chip-scale packaging (WLCSP) has evolved to provide an extremely high-volume, low-cost solution for the packaging of integrated circuits. And while it’s now a well-established technology, fragility of chip-scale devices remains a concern. SCHOTT offers a variety of specialty materials and technologies to enable improvements in the strength and reliability of WLCSP.