EML TEC TO Package (Pedestal)
Cooled header for EML applications, economical alternative to box packages.
About
The SCHOTT TEC TO package is a newly developed transistor outline (TO) which is ideal for laser diodes that require a thermoelectric cooler (TEC). The thermoelectric cooler allows for controlled heat dissipation, which leads to regulated and stable laser wavelengths and higher power signal transmission.TEC TO (Pedestal) are suitable for EML chips in single-channel DWDM in 10Gb Ethernet, CPRI, XGPON and other tunable laser applications.
Product variants
| Modul | Speed | OSA Type | Fiber | TO Can Description | Function |
|---|---|---|---|---|---|
| XFP | 25 Gbps 50 Gbps |
Tx | SMF | TO-56, 1 x 50-ohm, 6+1 | Large space for TEC, 2 TEC pin, Separate Thermistor, MPD, LD bias, 50-ohm Signal pin, one gnd pin |
Product images
25G EML Cool Header
25G EML Cool Header with components
50G Cooled EML Header
50G Cooled EML Header with components
Product performance
25G EML cooled header
S11 (dB) – Reflection/Return Loss
S11: Better than -15dB @30GHz for speeds of up to 25 Gbps.
S21 (dB) – Insertion Loss
S21: 3dB bandwidth better than 30GHz.
Pedestal TEC TO- simulation result-Port 1 Port 2
50G EML cooled header
Insertion and Return Loss
Simulation based on LD height of 2.5mm S11: Better than -15dB @40GHz S21: 3dB bandwidth better than 60GHz
Header with TEC, FPC and EML Submount
56 GBaud PAM4 Eye Diagram with 50G EML chip
simulation graphic of 50G Pedestal TEC TO, Port 1
Simulation graphic of 50G Pedestal TEC TO, Port 2, 3, 4
