FLEXINITY ® connectWith FLEXINITY® connect, SCHOTT is expanding its high precision structured glass portfolio FLEXINITY® towards very small holes in combination with highest amounts of structures - tailored for advanced packaging in the semiconductor industry.
Meeting tomorrow’s demands for the advanced packaging industry today
The world’s technology is changing at a rate that’s never been seen before. Devices are getting smaller, communication is getting quicker, and electronics systems are becoming more complex. To keep pace with this rapid development, SCHOTT has created a high-performance alternative to silicon and copper clad laminate.
FLEXINITY® connect offers increased design flexibility alongside the highest I/O counts and the lowest electrical resistance for advanced packaging. This exciting structured glass substrate provides manufacturers with a new-found level of freedom, giving them the opportunity to push their technology even further.
The semiconductor industry currently uses Printed Circuit Boards (PCB) and silicon interposers for advanced chip packaging solutions, but structured glass substrates have been considered a breakthrough technology for many years. Driven by the need for increased performance in data centers, 5G, and autonomous driving, laser structured glass is ideal for electronic applications.
Why is structured glass ideal?While silicon and copper clad laminate solutions are expensive and have low electrical performance and limited reliability, the smooth surface and excellent coefficient of thermal expansion (CTE) match of structured glass provides a high-performance alternative to traditional materials. This makes it the most suitable material for advanced packaging.
Why should you use structured glass?
Glass Circuit Boards not only reduce size and improve performance, they also enable embedding when compared to conventional interposer packages. Thanks to the structured glass core, new opportunities can be opened in the semiconductor chip packaging industry.
The key differentiating factors are:
- Compared to silicon, glass can improve signal performance and reduce signal latency, leading to increased microchip speeds.
- Due to lower processing costs, all passive devices can be placed on the structured
- The capability of embedding allows all passive device parts to be placed close to the semiconductor, resulting in reduced power loss and minimal electrical noise.
- Glass reduces the size and thermal load of the package to improve overall performance.
Conventional Interposer1) package vs. glass core package
Key features of FLEXINITY ® connect
Latest applications of FLEXINITY® connect
The exponential rise in data networks and AI systems has created an increasing demand for advanced packaging solutions that combine high thermal stability with low electrical loss. The adjusted thermal expansion of FLEXINITY® connect delivers an ability to handle high thermal loads, while its low dielectric constant reduces the time delay of digital signals.
Mobile and Internet of Things (IoT) communication is increasing in both speed and presence, with the integration of Antenna in Package (AiP) solutions, plus MEMS, filters, and active and passive components for miniaturization. FLEXINITY® connect has a range of properties that enables the construction of advanced Glass Circuit Boards for 5G and 6G communication, as well as AI.
The automotive sector is currently going through a major transformation, with autonomous driving one of its key developments. An increase in vehicle communication and radar applications has resulted in a demand for electronic packaging that delivers low thermal coefficients over a wide range of temperatures, as well as reduced dielectric loss and high flexibility.
FLEXINITY® connect has an increasing number of applications in the medical industry, from microfluidics in point-of-care diagnostics to high-throughput screening in R&D and life sciences. High precision in the µm-range makes it ideal for molecular diagnostics, while next-generation sequencing (NGS) benefits from its through-glass vias with narrow pitch.