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Technical Details for Proteon™ by SCHOTT Primoceler Oy

Miniaturization, enhanced functionality, and performance are critical for active medical implants and are becoming standard requirements for electronic components. Proteon™ glass packaging by SCHOTT Primoceler Oy is opening new doors towards miniaturization and design possibilities for future implant solutions.

A new breed of ultra-miniaturized and reliable hermetic sealing

Gas-tight sealing

Proteon™ by SCHOTT Primoceler Oy creates a fully hermetic seal, offering complete protection for sensitive encapsulated electronics in active medical implants.

Ultra-miniaturization

The latest technological developments offered by SCHOTT Primoceler Oy enable implant size dimensions starting from smaller than 1 millimeter.

RF transparency

Transparent glass encapsulation eliminates the need for wired connections as radio frequencies (RFs) can travel through the Proteon™ all-glass package from SCHOTT Primoceler Oy. This reduces bulk and complexity in device designs while allowing devices to be internet-connected by emitting and receiving wireless data signals.

Flexible customization

SCHOTT Primoceler Oy R&D experts will work with you at every step – from concept to volume production – to overcome your development challenges and create a customized solution.
Specifications

Specifications

Hermeticity and biocompatibility of Proteon™ packages for implants are based on three key factors:

  • laser-based Primoceler® Glass Micro Bonding
  • HermeS® hermetic through-glass-vias for electrical feedthroughs, and
  • Borofloat® 33 biocompatible glass.

Parameter Specification
 Glass type
  • Biocompatible Borofloat® 33 glass for medical implants.
  • Other glass types available.
 Glass thickness
  • Based on customer need. Typically, from 200 µm to a few millimeters.
 Hermeticity level for glass micro bonding
  • <1×10-11 atm cm2/s, fully hermetic for long-term implantation.
 Hermeticity level for HermeS®
  • <1×10-11 atm cm2/s, fully hermetic for long-term implantation.
 Glass micro bonding sealing temperature
  • 20 °C / room temperature.
 Gas backfill and pressure
  • Gas backfilled and pressure are controlled inside the implant.
  • Medical grade N2 or other inert gasses can be used.
 Implant package size
  • Dimensions starting from <1 mm. 
 Implant package shape
  • Rectangular or round, other shapes based on request.
 Metallization
  • Patterned metallization on both sides available.
  • Typical metals / electrode materials used: Ti, Pt, Au, IrO2.
 Through-glass-via material
  • Tungsten with Borofloat® glass, other materials available.
 Electronics assembly on glass
  • Pick & Place on glass available.
  • Soldering and adhesive chip and PCBA attachment on glass available.
 Gap between glass layers /
 additional materials
  • No gap and no additional materials used.
 Optical / dielectric coatings
  • Double-sided coating on glass over the whole area is available.

Want to know more? Let's talk

Whether you need more information, samples, a quote, or advice for a project, I would be delighted to talk to you.

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Headshot of Antti Peltonen in a blue shirt.
Antti Peltonen

Business Development and Marketing Manager