AF 32®

With a unique range of properties, as well as semiconductor process compatibility, AF 32® offers a flexible option for designers. This alkali-free glass is produced using SCHOTT’s unique down-draw process, which results in a broad thickness range, excellent transmittance and a superior surface quality.

Silicon semiconductor wafer under blue light

Smooth, stable and sturdy

SCHOTT AF 32® has a low coefficient of thermal expansion similar to a silicon wafer, making it ideally suited to wafer-level packaging in the semiconductor industry. With high thermal stability, high optical quality, excellent dielectric properties, and very low roughnesses, it fits a broad range of applications.

Sheet of SCHOTT AF 32® eco glass bent into an S-shape

A wide range of tightly controlled thicknesses

SCHOTT’s unique down-draw technology enables us to manufacture products between 0.03 mm and 0.5 mm in thickness. AF 32® is suited to large formats such as 12” wafers. Across all these options, tight geometric tolerances mean reliable performance, whatever your field of application.

Outstanding technical properties

The superior properties of SCHOTT AF 32® make it highly versatile. Combining a high level of technical properties such as size, bulk and surface quality with the excellent physical and chemical properties of high optical transmission, high thermal stability, a low dielectric loss factor, and a low CTE, AF 32® remains effective even within demanding environments. Alkali-free and manufactured without arsenic and antimony, AF 32® is the go-to glass for a large number of industries.

Various thicknesses available

AF 32® is available in a wide variety of thicknesses, from an extremely thin 30 µm up to 0.5 mm.

High transmittance

AF 32® shows excellent transmittance characteristics in the UV-A, visible and near-infrared ranges.

Low CTE

With a similar coefficiency of thermal expansion (CTE) as silicon, it is suitable as cover and substrate of silicon chips in semiconductor and MEMS industries.