SCHOTT Unveils Cutting-Edge Glass Solutions for Advanced Semiconductor Packaging at Semicon Taiwan 2025

Precision Engineered for the Future of Chips

Chip designs are growing increasingly more complex and miniaturized to meet the demanding requirements of advanced applications like AI and high-performance computing (HPC). That’s why manufacturers now require materials with exceptional quality and flatness.

SCHOTT addresses these challenges by pushing the boundaries of precision and reducing total thickness variation (TTV), providing specialty glass solutions with tailored material properties to meet the industry’s demands. SCHOTT leverages leading manufacturing capability and cutting-edge hot forming and surface treatment processing methods to reach the highest performance standards. Due to surging demand for premium products, SCHOTT is also accelerating the expansion of its production capabilities.

Besides extreme flatness, SCHOTT glass wafers and panels also benefit from exceptional qualities, such as mechanical and chemical robustness, high transmission, geometric accuracy, and wide thermal expansion rates, allowing tailored solutions for customers. SCHOTT glass carrier wafers can streamline processes such as 3D IC packaging, wafer thinning, and fan-out wafer-level or panel level packaging (FO-WLP; FO-PLP). SCHOTT glass panels also offer excellent thermal and chemical resistance, making them ideal for micro-structuring and metallization.

“At SCHOTT, we are aiming for the highest level of precision and quality to support manufacturers who look for breakthroughs in material science,” said Dr. Christian Leirer, Head of SCHOTT Semicon Glass Solutions. “By enhancing the surface quality of glass, we enable chip manufacturers to reach unprecedented levels of precision and yield in their processes.”

Excellence Backed by 140 Years of Expertise

For over a decade, SCHOTT has been providing the semiconductor industry with specialty materials, such as components for high-precision lithography machines and measurement equipment. From front-end to back-end manufacturing, SCHOTT offers glass solutions that meet the highest requirements for performance, integration, and energy efficiency. In early 2025, SCHOTT strengthened its portfolio of high-performance semiconductor materials through the successful acquisition of QSIL GmbH Quarzschmelze Ilmenau, reinforcing its position as a leading innovator in the industry.

Headquartered in Mainz, Germany, SCHOTT AG brings over 140 years of expertise in specialty glass, glass ceramics, and other specialty materials to the semiconductor industry. With a global R&D and production network, SCHOTT offers a wide range of glass types with a variety of thermal, mechanical, and electrical properties that can be tailored to meet diverse specifications.

Attendees of Semicon Taiwan 2025 are invited to visit SCHOTT’s booth (#L0022) to explore the full range of specialty glass solutions for semiconductor applications.