Welcome to SCHOTT Semicon next
An expert-led series for those navigating the industry’s next chapter – where advanced packaging and new materials are reshaping how computational growth continues.
What if glass enables next-gen chips?
As transistor scaling approaches physical limits, specialty glass is emerging as a promising material for advanced packaging. Through in-depth video sessions and technical whitepapers, our experts break down all the ways glass can support higher performance, improved energy efficiency, and scalable system architectures designed for advanced computing.
A legacy you can build on
With more than 140 years of specialty glass expertise, we’ve established enduring partnerships with almost every facet of the semiconductor industry.
- Decades of experience in microlithography and optical materials
- Dedicated technology focused on glass core substrates and advanced carrier applications
- A structured panel sample line supporting TGV development, prototyping, and validation
- Global application engineering teams across Europe, the US, and Asia
This series brings all our expertise under one roof, so you can gain data-driven insights shaped by real-world collaboration across the value chain.
Inside Semicon next
Why register?
Get full access to expert-led sessions and technical whitepapers focused on the role of glass in next-generation semiconductor packaging.
Explore the modules
Semicon next leads you through thematic modules – each addressing a critical dimension of advanced packaging. From the limits of transistor scaling, to material performance comparisons, to industrial adoption pathways, each module builds on the last.
Beyond Moore’s Law: Scaling through advanced packaging
Advanced packaging and continued scaling
For decades, computational growth relied on shrinking transistors. As scaling approaches physical limits and quantum effects emerge at sub-5 nm nodes, system-level integration becomes increasingly critical.
In this expert session, Colin Schmucker examines how glass is reshaping the semiconductor industry by propelling advanced packaging and high-performance semiconductor technologies to the next level.
Click the play button for a sneak preview.
Register to watch the full episode.
Beyond transistor scaling: the material shift
This whitepaper examines the physical and economic limits of transistor miniaturization and outlines how advanced packaging extends computational scaling. It explores the role of glass-core substrates in supporting thermomechanical stability, fine-pitch interconnects, and heterogeneous integration.
Register today and secure early access to future sessions!
Glass performs when it matters the most
What if glass outperforms today's materials?
In this expert session, Dr. Jochen Alkemper explores how glass compares to organics, ceramics, and silicon in stiffness, CTE control, TGV precision, and scalability – and why they matter for AI and HPC.
Glass scales from lab to fab
What if collaboration reduces technical and adoption risk?
Dr. Timo Luchs shares how glass moves from pilot validation to high-volume manufacturing – and how collaboration enables reliable integration.
Interested in how glass could support your semiconductor applications? Let’s talk.
Whether you need additional information, samples, a quote, or project guidance, our team would be happy to connect with you.
