Microelectronic Packaging

Often referred to as hybrid packages, multi-chip module housings, or IC packages, SCHOTT’s hermetic microelectronic packages protect sensitive electrical assemblies and components in ultra-tough operating conditions. They simultaneously enable reliable power and signal transmission.
Range of SCHOTT hermetic microelectronic packages on hot and cold background

First-class quality and reliability

Hermetic packages from SCHOTT meet the latest and toughest specifications, including extreme performance and lifetime expectations where other components fall short. The high quality of our microelectronic packages offers reliability in high pressure, vibration, and temperature conditions, as well as optimal processability for our customers' production lines.

Female scientist examining a multilayer ceramic substrate in a laboratory

Innovation and design support for next-level performance

Custom-designed for individual requirements, SCHOTT products are fit to meet the challenges of today and tomorrow. Our complete technology toolbox caters to special interface needs, miniaturization, high I/O count form factors, integrated and thermal management solutions, high-speed products, and lightweight, non-magnetic material requirements.

We are certified

All our production facilities are ISO 9001 certified. In addition, our products comply with the International Telcordia Specifications, are ROHS compatible and comply with MIL PRF-38534 and MIL STD-883.

Satellite in orbit around the Earth
News & Innovation stories

Clear message from orbit

The Proba-V satellite maps vegetation across the entire globe. It relies on gallium nitride amplifiers in hermetic high frequency housings.

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Interior of an aircraft cockpit with illuminated displays and controls

Mission-critical electronics reliably protected

In defense and aerospace applications, the quality of components and the reliability of the suppliers that provide them is critical. German hermetic packaging expert SCHOTT offers microelectronic packages for defense and aerospace systems.

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Illustration of a sensor in a twin exhaust emitting fire

A sensor packaging revolution

Pioneering technologies complement SCHOTT’s hermetic sensor packaging portfolio.

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Fairs and Events

Meet our experts on June 22-25, 2020 in Nuremberg, Germany, where they will be exhibiting at the SENSOR & TEST. They are looking forward to meeting you and having some vibrant discussions.

Next Event

JUN

22 - 25

SENSOR & TEST 2020

Nuremberg, Germany

Want to know more? Let's talk

Whether you need more information, samples, a quote, or advice for a project, I would be delighted to talk to you.

Get in touch
Michael Tratzky, Head of Sales Microelectronic Packaging
Michael Tratzky

Head of Sales Microelectronic Packaging