Microelectronic Packaging

Technologies

Glass-to-Metal Sealing – SCHOTT GTMS

• Glass-to-metal sealed (GTMS) microelectronic packages offer excellent performance when it comes to effectively protecting electronic systems, defending sensitive components against harsh environmental conditions, and supporting efficient transmission of optical signals.

• SCHOTT’s GTMS packages are extremely effective at protecting a comprehensive range of components – electronic, opto-electronic and microelectronic – in diverse industrial and technical fields, including microwave packaging, sensor and medical technology, and power electronics.

• Efficient transmission of optical signals. Protection for electronic, opto-electronic, and microelectronic parts. Diverse uses from sensor technology to power electronics.
  Detailed information about glass-to-metal sealing technology can be found here.

Laser Welding

• Laser welding is an innovative process that opens new possibilities for electrical and mechanical connection of components using the same or different material compositions.

• With this approach, the hermetic seal is formed at room temperature, which protects the electronics from heat damage.

• Laser welding is a flexible technique with multiple implementation possibilities. It can be performed at the component level all the way up to batch processing scales, making it easy and cost-effective to scale up for high-volume manufacturing.

• Because laser welding uses corrosion-resistant material, it is especially suitable for medical applications such as medical implants, batteries, and endoscopes.

Brazing and Soldering

• Brazing and soldering enable electrical, mechanical, and thermal connection of components using the same or different materials with similar CTEs.

• These connection techniques work well for any application but are especially useful for challenging packages that have a large number of electrical, optical, mechanical, and thermal interfaces.

• Metal brazing and soldering is ideal for large metal housings because it enables cost-effective manufacturing processes such as deep drawing and metal injection molding.

• The solder cascade can be outlined at temperatures ranging from 1100°C to soft soldering temperatures of 180°C.