Glass Micro Bonding by SCHOTT Primoceler
Up to the challenge: SCHOTT Primoceler Glass Micro Bonding is a proven superior alternative to existing sealing methods including anodic bonding, direct/fusion bonding, glass frit or epoxy (UV or thermal) encapsulation.
SCHOTT Primoceler can utilize HermeS® Through Glass Via (TGV) Wafers for feedthrough requirements.
SCHOTT Primoceler’s glass-to-glass sealing is done with a laser at room temperature without any additive materials.
SCHOTT Primoceler’s Glass Micro Bonding is a highly efficient wafer-level process that delivers high replicability, smaller device size, and more devices per wafer than conventional processes.
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