DCSIMG

Besides having a booth (Booth number 5269), a speech about bonding Ultra-Thin glass (UTG) wafers will be given. Primoceler’s bonding technology has proven to be a great solution when bonding Ultra-Thin glass. Due to minimal heat load during bonding, no post processing is needed. Furthermore, sensitive thin films will not be damaged during the bonding. Primoceler has been able to scale up the throughput, providing a good solution for mass production as well.