Primoceler presents their glass bonding technology at IMAPS 12th International Conference and Exhibition on Device Packaging in Arizona.
You will find Primoceler at: Poster Session, Wednesday March 16, 5.30 pm – 6.30 pm, Technical session, Thursday March 17, 11.15 am “Wafer-level packaging for ultra-thin glasses using hermetic room temperature welding technology”. Primoceler glass bonding technology for ultra-thin wafers will be presented by Mr. Antti Peltonen.
See you in Arizona!
Handling ultra-thin glass wafer.