Future material
for chip packaging

Dr. Michael Töpper from the Business Development team at Fraunhofer Institute for Reliability and Microintegration (IZM) about glass as ideal material for the semiconductor industry.

Dr. Töpper, is the semiconductor industry aware of the advantages of using ultra-thin glass?

No, because this requires more education. First, introducing new materials in the conservative semiconductor industry is difficult. In addition, everyone believes they know glass to be a brittle and easily breakable material. But, depending on the type, glass has various properties. And some of them are ideal for use in chip packaging and high-frequency technology.

Which properties are you referring to?

First, it has excellent dielectric properties. Glass ensures the lowest possible energy losses, especially at high signal frequencies such as those that are used in the new radio frequency standard LTE or in future radar systems for autonomous driving. And unlike polymer materials, the quality does not change over time because glass hardly ages and can also protect electronic microcomponents against environmental influences.

Where could ultra-thin glasses be used first?

Consumer electronics and smartphone applications, such as displays or sensors, are the first products that come to mind. Then, I expect to see them used in the automotive world, where the highest reliability and quality are extremely important.

What products does the IZM cooperate with SCHOTT on?

Today, the focus is on developing interposers on the basis of ultra-thin glasses. In SCHOTT, we have found an ideal partner for making such promising future applications marketable.

Dr. Michael Töpper from the IZM expects big chances for ultra-thin glass in display and sensor applications.

Dr. Töpper promoted at the TU Berlin and headed a working group at Fraunhofer IZM, which is concerned with processes at wafer level. Since 2006 he is also a Research Associate Professor at the University of Utah, USA. He is the author and co-author of more than 130 scientific papers on electronic packaging. Dr. Töpper is a co-founder of the SECAP International Consortium for Advanced Packaging, and is currently a member of the IEEE Technical Committee of Wafer Level Packaging.

Interposers connect microelectronic components inside a much smaller space than traditional printed circuit boards

January 15th, 2017


Dr. Tobias Gotschke
Research & Development New Venture