Business Unit Electronic Packaging - Technology Overview

Over the decades, we have developed extensive know-how that is particularly important for hermetic packaging and in the field of electronic packaging technology. These include glass or ceramic-to-metal sealing technology and special plating processes for improved surface finishes. Additionally, we are constantly adding to or improving our broad range of special glass materials for electronics and life sciences.

For more information about our electronic packaging technology, please refer to your specific area of interest:
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Trade Fairs & Events
09.
September
Trade fair CIOE - China International Optoelectronic Exposition, Shenzhen, China, 09.09 - 11.09.2020
29.
September
Trade fair Battery Experts Forum, Frankfurt, Germany, 29.09 - 01.10.2020
16.
November
Trade fair Sensors Expo & Conference, San Jose, CA, USA, 16.11 - 18.11.2020
12.
January
Trade fair European Microwave Week, Utrecht, Netherlands, 12.01 - 14.01.2021
Contact
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SCHOTT AG
Christoph-Dorner-Strasse 29
84028 Landshut
Germany
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E-Mail to SCHOTT+49 (0)871/826-0