Electronic Packaging Technology

Over the decades, we have developed extensive know-how that is particularly important for hermetic packaging and in the field ofelectronic packaging  technology . These include glass or ceramic-to-metal sealing technology and special plating processes for improved surface finishes. Additionally, we are constantly adding to or improving our broad range of special glass materials for electronics and life sciences.

For more information about our electronic packaging technology, please refer to your specific area of interest:
Trade Fairs & Events
04.
September
25.
September
Trade fair Automotive LiDAR 2019, Detroit, MI, USA, 25.09 - 26.09.2019
01.
October
Trade fair European Microwave Week 2019, Paris, France, 01.10 - 03.10.2019
Contact
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SCHOTT AG
Christoph-Dorner-Strasse 29
84028 Landshut
Germany
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E-Mail to SCHOTT+49 (0)871/826-0
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