Business Unit Electronic Packaging - Technology Overview

Over the decades, we have developed extensive know-how that is particularly important for hermetic packaging and in the field of electronic packaging technology. These include glass or ceramic-to-metal sealing technology and special plating processes for improved surface finishes. Additionally, we are constantly adding to or improving our broad range of special glass materials for electronics and life sciences.

For more information about our electronic packaging technology, please refer to your specific area of interest:
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Trade Fairs & Events
29.
January
Trade fair LED Japan, Tokyo, Japan, 29.01 - 31.01.2020
04.
February
Trade fair SPIE PhotonicsWest, San Francisco, USA, 04.02 - 06.02.2020
11.
February
Trade fair Medical Design & Manufacturing (MD&M) West, Anaheim, CA, USA, 11.02 - 13.02.2020
10.
March
Trade fair OFC-Optical Networking and Communication Conference & Exhibition, San Diego, USA, 10.03 - 12.03.2020
Contact
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SCHOTT AG
Christoph-Dorner-Strasse 29
84028 Landshut
Germany
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E-Mail to SCHOTT+49 (0)871/826-0
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