HTCC Multilayer Packages & Substrates
Hermetic multilayer ceramic packages and substrates are ideal for more complex packaging solutions, such as micro-electronic-mechanical systems (MEMS) and high frequency applications because such packages are hermetic and enable a large number of electrical feedthroughs within very small spaces.
- Customized solutions based on a variety of manufacturing processes
- Fast and efficient development due to high degree of design support from the beginning
- A variety of mechanical, thermal (ANSYS, ABACUS), optical (ZEMAX) and electrical (HFSS, ADS) simulation tools
- Worldwide customer support from local manufacturing facilities with technical competence centers
- Data communication
- Microwave packaging
- Industrial lasers
- Sensor applications (automotive, medical, defense)
- Power electronics
- MEMS technology
Multilayer ceramic packages are produced from a combination of metal pastes and ceramic green sheets. These green sheets contain a small proportion of organic substrates to achieve flexibility and the possibility to perform punching and green cutting processes.
SCHOTT has proprietary recipes for green sheets and refractory metal pastes used in the manufacture of HTCC. For LTCC, the DuPont 951 green sheet is widely used in combination with various metal paste systems, depending on the metal surface application (soldering, wire bonding, etc.) Typical processes involve via punching, via filling, screen printing of pattern, laminating and firing.
Two types of multilayer ceramics are available; a full ceramic package (e.g. by providing a cavity for the devices) or an essential component for a more complex hybrid package including additional optical, thermal or mechanical functionalities.
Features / Specifications
Microelectronic packages are customized products manufactured according to customer specifications. A typical package is composed of the metal body, ceramic substrates, optical components (e.g. window, lenses, etc.) and heat sink materials. As such, the design and specifications of different microelectronic packages can vary greatly depending on the application in which they are used in and may, amongst others, include the following features:
- High density electrical feedthroughs realized by multilayer ceramics (high voltage and current, DC or HF
- Standard coaxial connectors (SMA, SMP, etc.)
- Thermal interfaces (heat sinks made from e.g. Cu, CuW or CuMo)
- Optical interfaces (windows, lenses, fiber optic ferrules, etc.)
- Mechanical interfaces (housings, brackets, fiducials)
Forms of Supply and Product Packaging
All products can be packed individually and supplied on trays.
For more information about SCHOTT's high and low temperature cofired multilayer ceramics co-developed with VIA electronic GmbH, please refer to the downloads.
To find out more about VIA electronic and the company's technology, please refer to the VIA electronic Homepage.