Microelectronic Packages with Glass-to-Metal Sealing (GTMS)

Product Description

In addition to the standard types of packaging such as TO packaging, there is a whole range of other opto-electronic applications that require special packaging. These range from individual sensors to switching systems that require total encapsulation. Glass-to-metal sealed (GTMS) microelectronic packages (otherwise known as hybrid packages) are manufactured according to the requirements of the components requiring protection and fulfill three vital functions.
 
  • Provide electronic components with power
  • Protect the sensitive modules from harsh environmental conditions
  • Ensure the efficient transmission of optical signals

Advantages

GTMS feedthroughs provide encapsulated microelectronic packages with:
  • Effective hermetic sealing
  • Long-term efficacy
  • High reliability

In addition, our extensive glass processing capabilities ensure the use of highly reliable and extremely accurate optical components for optical signal transmission.

As these feedthroughs do not have standard designs, all of our products are designed and produced in close collaboration with our customers’ needs.

Applications

The range of components - whether electronic, opto-electronic or microelectronic (MEMS) - that can be reliably protected using glass-to-metal sealed feedthroughs are wide ranging. Some of the most common applications include components used in the areas of:
  • Data communication
  • Microwave packaging
  • Industrial lasers
  • Medical technology
  • Sensor technology
  • Power electronics

Technical Details

Technology

GTMS feedthroughs for hybrid packaging, as well as compression glass seals, are manufactured as matched. The types of glass and metal used, as well as the types of electroplating, can be adapted to customer requirements.

Please click on the GTMS technology page for more information.


Features / Specifications

All microelectronic packages are produced according to customer specifications, since there are no general standards governing their manufacture.

The design and specifications of different microelectronic packages can vary greatly depending on the application in which they are used, and may, amongst others, include the following features:
  • Various optical components (windows, lenses, fiber optic ferrules, etc…)
  • (Partial) Heat sink for dissipating heat loss from the active device (Cu-W, Mo, Al-Si, Mo-Cu)
  • Coaxial (e.g. SMA, SMP, etc…) and planar (microstrip, co-planar, grounded co-planar) high frequency interfaces up to 40 GB/s,
  • Feedthroughs for high currents
  • High-voltage feedthroughs
Microelectronic packaging can also be fitted with application-specific components such as ceramic substrates, TEC’s, etc.


Forms of Supply and Product Packaging

All products can be packed individually and supplied on trays.

Quality

All our production facilities are ISO 9001 certified. In addition, all our products comply with the International Telcordia Specifications, are ROHS compatible and comply with MIL PRF-38534 and MIL STD-883.
Trade Fairs & Events
30.
May
Trade fair Materials, Veldhoven, Netherlands, 30.05 - 31.05.2018
05.
September
Trade fair CIOE - China International Optoelectronic Expo, Shenzhen, China, 05.09 - 08.09.2018
17.
September
Trade fair Gastech, Barcelona, Spain, 17.09 - 20.09.2018
25.
September
Trade fair European Microwave Week, Madrid, Spain, 25.09 - 27.09.2018
Contact
SCHOTT AG
Christoph-Dorner-Strasse 29
84028 Landshut
Germany
E-Mail to SCHOTT+49 (0)871/826-0
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