DML TEC TO Package
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High performance, miniaturized and economical alternative to box packages
The SCHOTT TEC TO package is a newly developed transistor outline (TO) which is ideal for laser diodes that require a thermoelectric cooler (TEC). The thermoelectric cooler allows for controlled heat dissipation, which leads to regulated and stable laser wavelengths and higher power signal transmission.
DML TEC TO for single-channel DWDM in 25G CPRI, XGPON OLT Tx and other tunable laser applications.
DML TEC TO for single-channel DWDM in 25G CPRI, XGPON OLT Tx and other tunable laser applications.
Product Features
- Designed for 25G DFB laser (on TEC)
- Includes submount with 25ohm impedance G-S-G-S-G traces capable of 25 GBit/s
- Asymmetric design for mass producibility at affordable prices
- Potential application in XGPON
Product Variants
TEC TO
TEC TO with components
Product Performance
S11 (dB) – Reflection/Return Loss
S21 (dB) – Insertion Loss
S11: Better than -15dB @25GHz for speeds of up to 25 Gbps.
S21: 3dB bandwidth better than 30GHz.
Matched TO cap types
Matched with Lens cap, molded mini Lens, window cap solder type and window cap mold type.
For other caps, please visit www.schott.com/epackaging/english/opto/to_caps/index.html
Don't be shy
Contact our experts, Mr. Robert Hettler and Ms. Amy Soon for more product information by the following mail form and our team will promptly respond to your inquiry
SCHOTT AG promises that all data entered into a web form will only be used for internal purposes. For more detailed information, please refer to our data protection guidelines.
