Electronic Packaging Exhibitions

04.02 - 06.02.2020

SPIE Photonics West

San Francisco, USA
South Hall / Booth # 841
Materials Make the Difference - Let's Drive Innovation with Superior Materials
Explore our latest innovations for yourself during SPIE Photonics West at our booth # 841. From advancements in Augmented Reality to Laser Technology, we are moving innovations forward in a multitude of applications with our specialty glass and optical components. 

Participating Business Areas

Advanced OpticsAdvancements in high refractive index wafers for augmented reality and ceramic converters for digital projection will be on display at our booth. In addition, learn how WaveOptics & SCHOTT bring AR to the next level. Join our media & industry event at SPIE Photonics West on February 3rd from 11:30 – 12:30 in Room 2010 (Level 2 West). More
BOROFLOATGlass solutions from SCHOTT can improve your LiDAR sensor. High-quality protective windows are needed to withstand harsh conditions. Our BOROFLOAT 33 glass offers the advantages of outstanding thermal resistance, exceptionally high transparency, high chemically durability, and excellent mechanical strength. More
Electronic PackagingElectronic packaging is the key to LiDAR safety - learn why high performance sensor packaging is crucial in high-level advanced driver assistance systems (ADAS). Learn more about how hermetic package components from SCHOTT use proven Glass-to-Metal Sealing (GTMS) and Ceramic-to-Metal Sealing (CerTMS®) technology to offer a suitable package solution for UV LED modules. More
Lighting and ImagingSCHOTT's lighting components are advancing the medical industry through single-use endoscopes and high performance laser delivery technology for light-based therapies. More
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