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09.10.2017, Landshut, Germany

Mission-Critical Electronics Reliably Protected

In defense and aerospace applications, the quality of components and the reliability of the suppliers that provide them is critical. German hermetic packaging expert SCHOTT will showcase its capabilities and product offerings in hermetic microelectronic packages and substrates for defense and aerospace systems at European Microwave Week 2017 in Nuremberg, Germany.
In high-frequency defense and aerospace applications, hermetically-sealed housings are essential for the reliable protection and long-term functionality of sensitive electronics. SCHOTT Electronic Packaging is a premier supplier of glass-to-metal sealed hermetic packages for these industries. Components and systems supported include power amplification in aerospace communication, TRM modules, cooled and uncooled IR detection, high-temperature sensors and laser warning receivers, as well as microwave and power supply for E-Scan radar.

First-Class Product Quality and Operational Excellence

For mission-critical defense and aerospace electronics, uncompromising reliability of components is of the utmost importance. As a dedicated and decades-long supplier to the industry, SCHOTT manufactures products that meet the highest performance and lifetime expectations, even in working environments with extreme pressure, vibrations and temperatures in excess of of 175 degrees Celsius (347° F).

“When it comes to reliability, we offer quality beyond just the product: we have a flexible internal set-up and place high importance on operational excellence across the board, including R&D, production, and administrative services. This has enabled us to shorten quotation times and deliver prototypes and series products with speed,” explains Michael Tratzky, Head of Sales for Microelectronic Packages at SCHOTT. 

Unmatched Technical Design Support and Consultation

When working with customers, SCHOTT’s experts draw on more than 75 years of experience in developing and manufacturing hermetically-sealed packages. “Our technical know-how and design capabilities encompass Glass-to-Metal-, Ceramic-to-Metal- (CerTMS©) and Multilayer High-Temperature Co-Fired Ceramic (HTCC) technologies.” says Dr. Thomas Zetterer, Head of R&D for Microelectronic Packages at SCHOTT in Landshut.

Utilizing decades of comprehensive expertise, SCHOTT can cater to customer-specific interface needs, resulting in fully customized products optimized to fulfill electrical, mechanical, optical and thermal requirements.

Miniaturization and Thermal Management: The Advantages of HTCC Multilayer Ceramic

In addition to its signature Glass-to-Metal Sealing technology expertise, SCHOTT has significant in-house capabilities in HTCC technology. Multilayer design enables the production of miniature 3D interconnect solutions, paving the way for high-density input/output capability in small-form packages for both feedthroughs and circuit board substrates. Superior thermal conductivity of the material and temperature resistance beyond 300 degrees Celsius (572° F) make HTCC technology a perfect fit for high-power aerospace applications.
High-Speed Products. Integrated Solutions.

Catering to the increased need for high-speed products, SCHOTT offers its “hybrid” packages with high-frequency ports, in the form of either coaxial Glass-to-Metal- or coplanar Ceramic-to-Metal sealed connections. SCHOTT also offers integrated features, such as standard connectors or circuits that are incorporated in the HTCC feedthrough substrate. Such offerings enable reduced headaches and increased efficiency for customers, who can remove these steps from their own production processes.
Long-Term Supply Security from a Reliable European Partner

“Due to the nature of their projects, our customers are reliant on long-term partnerships with well-established, financially stable suppliers. SCHOTT’s 130-year history includes its ownership by the Carl Zeiss foundation – an arrangement that signifies a focus on sustainable growth and innovation-minded customer relationships,” says Michael Tratzky.  

All microelectronic housings and substrates are developed and manufactured by a specialized and dedicated team at SCHOTT’s site in Landshut, near Munich. This designates SCHOTT microelectronic components as 100% Made in Germany, an important aspect for European defense and aerospace industries.
Meet SCHOTT at the European Microwave Week 2017 (October 10-12, Nuremberg) at booth 206 in hall 7a.

SCHOTT is a leading international technology group in the areas of specialty glass and glass-ceramics. The company has more than 130 years of outstanding development, materials and technology expertise and offers a broad portfolio of high-quality products and intelligent solutions. SCHOTT is an innovative enabler for many industries, including the home appliance, pharma, electronics, optics, life sciences, automotive and aviation industries. SCHOTT strives to play an important part of everyone’s life and is committed to innovation and sustainable success. The group maintains a global presence with production sites and sales offices in 34 countries. With its workforce of approximately 15,000 employees, sales of 1.99 billion euros were generated in fiscal year 2015/2016. The parent company, SCHOTT AG, has its headquarters in Mainz (Germany) and is solely owned by the Carl Zeiss Foundation. As a foundation company, SCHOTT assumes special responsibility for its employees, society and the environment.
Press contact
Michael Mueller
Public Relations Manager
Hattenbergstraße 10
55122 Mainz
Phone: +49 6131/66-4088
Further information
Salvatore Ruggiero
Vice President Marketing and Communication
Hattenbergstraße 10
55122 Mainz
Phone: +49 6131/66-4140