Ultra-Thin Glass

Product Information

Ultra-thin glass - flexible, slim and tough

Based on our proprietary down-draw technology, we are supplying ultra-thin glass with the tightest geometrical tolerances from a reliable mass production environment forvarious industries, including:

Semiconductor
Opto-electronic
Consumer electronic
Automotive
Biotech industry

SCHOTT ultra-thin glass is available in different glass types with diverse chemical and physical properties in a thickness range of 25 - 210 μm.

AF 32^® eco - best fit to silicon
D 263^® T eco and SCHOTT AS 87 eco - the only chemically strengthenable ultra-thin glasses

SCHOTT’s proprietary down-draw technology

SCHOTT’s proprietary down-draw technology

Technology proven in mass production of millions of square meters of ultra-thin glass (25 - 210 µm) for biotech, cover and touch and sensor applications

Untouched surface

Versatile technology not only in thickness, but also with respect to a broad portfolio of glass compositions

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Advantages

Below, you will find an extract of relevant application areas for SCHOTT ultra-thin glass:

Ultra-thin glass for display and touch & cover

Display and Touch & Cover

Superior haptics and customer experience with high scratch resistance
Bendable without fatigue
Allows the highest optical quality and longer-living, reliable OLED displays due to high temperature resistance during processing and unsurpassed barrier properties
Cost efficient with an established supply chain

Ultra-thin glass for fingerprint sensors

Fingerprint Sensor

Highest dielectric constant
Unmatched toughness in the market
Highest thickness uniformity

Ultra-thin glass for camera module

Camera Module

Scratch-resistant, tough but ultra-thin cover glass
ultra-thin glass as a key element of the product roadmap

Ultra-thin glass for IC packaging

IC Packaging

Stiffer than organic substrate/packaging materials
Highest dimensional stability
Lower loss than silicon for high bandwidth/high frequency applications
Laser structuring enables cost efficieny

Ultra-thin glass for micro-batteries

Micro-Batteries

High fit to manufacturing technology of semiconductor and display industry
Withstands high process temperatures (≈ 600°C)
Thermal expansion of substrate fits to cathode material
Chemical compatibility
Cost-efficient by scaling to larger substrates

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What’s your next milestone?

The application possibilities for bendable glass are unlimited. Let’s challenge existing thoughts. We are happy to support you on your ideas, please contact us.

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Supply Forms

Supply Forms and Geometrical Tolerances
Thickness	25 µm 30 µm 50 µm 70 µm 100 µm 145 µm 175 µm 210 μm
Sheet size	up to 500 x 500 mm²
Wafer size	50 mm Ø 100 mm Ø 150 mm Ø 200 mm Ø 300 mm Ø
Surface roughness R_a	< 1 nm
Total thickness variation	≤ 5 μm
Thickness tolerance	± 10 μm
Formate tolerance	± 200 μm

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Technical Details

Mechanical properties for ultra-thin glass

Mechanical Properties	D 263^® T eco	AF 32^® eco
Density	2.51 g/cm³	2.43 g/cm³
Knoop hardness	470 @ 0.1/20	580 @ 0.1/20
Young‘s modulus	72.9 KN/mm²	74.8 KN/mm²

Mechanical properties of ultra-thin glass

Thermal properties of ultra-thin glass

Thermal Properties	D 263^® T eco	AF 32^® eco
T_g	557 °C	717 °C
CTE (20 °C – 300 °C)	7.2 10 ^–6 · K^–1	3.2 10 ^–6 · K^–1
Thermal conductivity	1.06 W/mK @ 90 °C	1.16 W/mK @ 90 °C

Electrical properties of ultra-thin glass

Electrical Properties	D 263^® T eco	AF 32^® eco
Dielectric constant ε_r	6.7 @ 1 MHz 6.4 @ 1 GHz 6.3 @ 5 GHz	5.1 @ 1 MHz 5.1 @ 1 GHz 5.1 @ 5 GHz
Dissipation factor tan δ	0.006 @ 1 MHz 0.007 @ 1 GHz 0.010 @ 5 GHz	0.003 @ 1 MHz 0.004 @ 1 GHz 0.005 @ 5 GHz

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Chemical properties of ultra-thin glass

Chemical Properties	D 263^® T eco	AF 32^® eco
Glass type	Borosilicate	Alumino-borosilicate
Hydrolytic resistance	HGB 1	HGB 1
Acid resistance	S2	S4
Alkaline resistance	A2	A3
Alkaline free	no	yes

Examples of competencies to modify ultra-thin glass (under development)

Structuring by Laser or Powder Blasting
to generate vias or microchannels

Example: laser structuring of SCHOTT AF 32^® eco, 100 μm thickness, via diameter: 30 μm, pitch: 50 μm

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Optical properties of AF 32 ® eco and D 263® T eco

Chemical strengthening of ultra-thin glass

By chemical toughening, the edge strength of D 263^® T eco can be increased by a factor of 4.

Chemical strengthening of ultra-thin glass

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Gas barrier properties for ultra-thin glass

Carrier Solutions
  
SCHOTT can provide access to partners providing semicon standard handling solutions for ultra-thin glass to be handled on glass carriers with an adhesive bonding systems.

SCHOTT is developing adhesive-free bonding solutions of ultra-thin glass to carriers for wafer and sheet form factors.   

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