Ultra-Thin Glass
Ultra-thin glass - flexible, slim and tough
Based on our proprietary down-draw technology, we are supplying ultra-thin glass with the tightest geometrical tolerances from a reliable mass production environment forvarious industries, including:- Semiconductor
- Opto-electronic
- Consumer electronic
- Automotive
- Biotech industry
SCHOTT ultra-thin glass is available in different glass types with diverse chemical and physical properties in a thickness range of 25 - 210 μm.
AF 32® eco - best fit to silicon
D 263® T eco and SCHOTT AS 87 eco - the only chemically strengthenable ultra-thin glasses
SCHOTT’s proprietary down-draw technology
SCHOTT’s proprietary down-draw technology
- Technology proven in mass production of millions of square meters of ultra-thin glass (25 - 210 µm) for biotech, cover and touch and sensor applications
- Untouched surface
- Versatile technology not only in thickness, but also with respect to a broad portfolio of glass compositions
Below, you will find an extract of relevant application areas for SCHOTT ultra-thin glass:
Ultra-thin glass for display and touch & cover
- Superior haptics and customer experience with high scratch resistance
- Bendable without fatigue
- Allows the highest optical quality and longer-living, reliable OLED displays due to high temperature resistance during processing and unsurpassed barrier properties
- Cost efficient with an established supply chain
Ultra-thin glass for fingerprint sensors
- Highest dielectric constant
- Unmatched toughness in the market
- Highest thickness uniformity
Ultra-thin glass for camera module
- Scratch-resistant, tough but ultra-thin cover glass
- ultra-thin glass as a key element of the product roadmap
Ultra-thin glass for IC packaging
- Stiffer than organic substrate/packaging materials
- Highest dimensional stability
- Lower loss than silicon for high bandwidth/high frequency applications
- Laser structuring enables cost efficieny
Ultra-thin glass for micro-batteries
- High fit to manufacturing technology of semiconductor and display industry
- Withstands high process temperatures (≈ 600°C)
- Thermal expansion of substrate fits to cathode material
- Chemical compatibility
- Cost-efficient by scaling to larger substrates
What’s your next milestone?
The application possibilities for bendable glass are unlimited. Let’s challenge existing thoughts. We are happy to support you on your ideas, please contact us.
Supply Forms and Geometrical Tolerances |
|
|---|---|
| Thickness |
|
| Sheet size | up to 500 x 500 mm² |
| Wafer size |
|
| Surface roughness Ra | < 1 nm |
| Total thickness variation | ≤ 5 μm |
| Thickness tolerance | ± 10 μm |
| Formate tolerance | ± 200 μm |
Mechanical properties for ultra-thin glass
Mechanical Properties |
D 263® T eco |
AF 32® eco |
|---|---|---|
| Density | 2.51 g/cm3 | 2.43 g/cm3 |
| Knoop hardness | 470 @ 0.1/20 | 580 @ 0.1/20 |
| Young‘s modulus | 72.9 KN/mm2 | 74.8 KN/mm2 |
Mechanical properties of ultra-thin glass
Thermal properties of ultra-thin glass
Thermal Properties |
D 263® T eco |
AF 32® eco |
|---|---|---|
| Tg | 557 °C | 717 °C |
| CTE (20 °C – 300 °C) | 7.2 10 –6 · K–1 | 3.2 10 –6 · K–1 |
| Thermal conductivity | 1.06 W/mK @ 90 °C | 1.16 W/mK @ 90 °C |
Electrical properties of ultra-thin glass
Electrical Properties |
D 263® T eco |
AF 32® eco |
|---|---|---|
| Dielectric constant εr | 6.7 @ 1 MHz 6.4 @ 1 GHz 6.3 @ 5 GHz |
5.1 @ 1 MHz 5.1 @ 1 GHz 5.1 @ 5 GHz |
| Dissipation factor tan δ | 0.006 @ 1 MHz 0.007 @ 1 GHz 0.010 @ 5 GHz |
0.003 @ 1 MHz 0.004 @ 1 GHz 0.005 @ 5 GHz |
Chemical properties of ultra-thin glass
Chemical Properties |
D 263® T eco |
AF 32® eco |
|---|---|---|
| Glass type | Borosilicate | Alumino-borosilicate |
| Hydrolytic resistance | HGB 1 | HGB 1 |
| Acid resistance | S2 | S4 |
| Alkaline resistance | A2 | A3 |
| Alkaline free | no | yes |
Examples of competencies to modify ultra-thin glass (under development)
Structuring by Laser or Powder Blasting
to generate vias or microchannels
Structuring by Laser or Powder Blasting
to generate vias or microchannels
Example: laser structuring of SCHOTT AF 32® eco, 100 μm thickness, via diameter: 30 μm, pitch: 50 μm
Chemical strengthening of ultra-thin glass
By chemical toughening, the edge strength of D 263® T eco can be increased by a factor of 4.
By chemical toughening, the edge strength of D 263® T eco can be increased by a factor of 4.
Chemical strengthening of ultra-thin glass
Carrier Solutions
SCHOTT can provide access to partners providing semicon standard handling solutions for ultra-thin glass to be handled on glass carriers with an adhesive bonding systems.
SCHOTT is developing adhesive-free bonding solutions of ultra-thin glass to carriers for wafer and sheet form factors.
SCHOTT can provide access to partners providing semicon standard handling solutions for ultra-thin glass to be handled on glass carriers with an adhesive bonding systems.
SCHOTT is developing adhesive-free bonding solutions of ultra-thin glass to carriers for wafer and sheet form factors.
Flexible Glass for Printed Electronics from SCHOTT
Innovations in Ultra-Thin Glass
