FOTURAN^® II

Product Information

Photo-Sensitive glass wafer

FOTURAN^® II is an improved photo-sensitive glass based on the well-known FOTURAN^®. It is produced in a continuous melting process with optimal homogeneity.

FOTURAN^® II is a technical glass that crystallizes after UV exposure and temperature processes. The crystallized areas can be etched away with a high aspect ratio, resulting in extremely fine structures and vias. After a second exposure and tempering process, FOTURAN^® II can be transformed into a glass ceramic.

If needed, structured FOTURAN^® II substrates can be applied in the semiconductor chip and semiconductor packaging processes. The process flow works without photo-resist and can be used with standard semiconductor equipment.

Top

Advantages

Supply Forms

FOTURAN^® II is available as:

Supply Form Sizes*
Round (wafer)	6" 8" 12" (in preparation)
Square (substrate)	93 x 93 mm 130 x 130 mm 150 x 150 mm 175 x 175 mm
FOTURAN^® II Sample Kit	Incl. one 93 x 93 x 0.5 mm and one 6" x 0.5 mm wafer

* Standard thicknesses for each format: 0.5/0.7/1.0 /1.3 mm.
Other formats and thicknesses available upon request.

Typical post-processing tolerances**
Roughness of the inner surface of the etched structures	1–3 μm
Roughness of surface of the non-exposed area	< 5 nm
Maximum hole density (holes / cm²)	10,000
Tolerance of hole distance (per 100 mm)	< ± 0.3 % (100 mm ± 300 μm)

** Values based on SCHOTT standard processing parameters. Above values are an indication, not guaranteed limits and may also based on processing parameters.

Top

Technical Details

Mechanical Properties - Glass and Ceramic State
	Glass State	Ceramic State ***
		ceramized at 560 °C	ceramized at 810 °C
Density ρ in g /cm³	2.37	-	-
Knoop hardness HK 0.1/20	480	510	500
Vickers hardness HV 0.2/25	520	560	480
E-Modulus in GPa	76.5	81.2	91.0
Poisson number v	0.21	0.19	0.18

*** All data subject to change

Thermal Properties
Transformation temperature Tg in °C	455
Coefficient of mean linear thermal expansion α (20 °C; 300 °C) in 10^–6 K^–1 (Static measurement)	8.49
Thermal conductivity λ in W / (m*K)(ϑ = 90 °C)	1.28

Electrical Properties - Glass and Ceramic State
		Glass State	Ceramic State ***
	Frequency [GHz]	annealed at 40°C/h	ceramized at 560°C	ceramized at 810°C
Dielectric constant (Permittivity) ε_r	1.1	6.4	5.8	5.4
	1.9	6.4	5.9	5.5
	5	6.4	5.8	5.4
	24	-	5.87	5.41
	77	-	5.61	5.27
Dissipation factor tan δ (* 10^–4)	1.1	84	58	39
	1.9	80	65	44
	5	109	79	55
	24	-	146	105
	77	-	185	135

*** All data subject to change

Chemical Properties
			Class
Hydrolytic resistance acc. to DIN ISO 719	(μg) Na2O/g	578	HGB 4
Acid resistance acc. to DIN 12116	mg/dm²	0.48	S 1
Alkali resistance acc. to DIN ISO 695	mg/dm²	100	A 2

Optical Properties - Glass and Ceramic State
		Glass State	Ceramic State ***
	Wavelength (nm)	annealed at 40°C/h	ceramized at 560°C	ceramized at 810°C
Refractive index	300	1.549	n/a	n/a
	486.1 (n_F)	1.518	1.519	1.532
	546.1 (n_e)	1.515	1.515	1.528
	587.6 (n_d)	1.512	1.513	1.526
	656.3 (n_c)	1.510	1.511	1.523
Spectral transmittance τ (λ) [in %, 1 mm thickness]	t₂₅₀	0.1	-	0.02
	t₂₆₀	0.5	-	0.02
	t₂₇₀	3	-	0.01
	t₂₈₀	11	-	0.02
	t₂₉₅	29	-	0.02
	t₃₁₄	37	-	0.01
	t₃₅₀	89	-	0.01

*** All data subject to change

Top

Photo-Sensitive glass wafer

FOTURAN® II

Product Information

Photo-Sensitive glass wafer

Advantages

Supply Forms

Supply Form Sizes*

Technical Details

Mechanical Properties - Glass and Ceramic State

Glass State

Ceramic State ***

ceramized at 560 °C

ceramized at 810 °C

Thermal Properties

Electrical Properties - Glass and Ceramic State

Glass State

Ceramic State ***

Frequency [GHz]

annealed at 40°C/h

ceramized at 560°C

ceramized at 810°C

Chemical Properties

Optical Properties - Glass and Ceramic State

Glass State

Ceramic State ***

Wavelength (nm)

annealed at 40°C/h

ceramized at 560°C

ceramized at 810°C

Downloads

FOTURAN^® II

annealed
at 40°C/h

ceramized
at 560°C

ceramized
at 810°C

annealed
at 40°C/h

ceramized
at 560°C

ceramized
at 810°C