SCHOTT AG - Materials

Materials

The following glass types are available to produce the Glass Wafer & Substrates according to your requests:

Main characteristics of BOROFLOAT^® 33:

Low thermal expansion coefficient close to Silicon (a20°C – 300°C = 3.25 x 10–6 K–1)

Excellent transparency

High thermal resistance

High resistance to chemical solvents

Available in various thickness: 0.7; 1.1 to 7.5 mm

Suitable for Anodic Bonding

[to the product side]

Main characteristics of Lithosil^®:

High laser durability

Excellent transmission

Low fluorescence

High resistance to chemical solvents

Bubbles and inclusions 1/1 x 0.063 (according ISO 10110-3)

[to the product side]

Main characteristics of D 263 T^™ eco:

Coefficient of thermal expansion match with metals for hermetic sealings (a20°C – 300°C = 7.2 x 10–6 K–1)
High temperature resistance
High luminous transmission
Stable against sunlight and heat
Flexibility is similar to that of plastic
Smooth fire-polished surface

Main characteristics of AF 32^™ eco:

Low thermal expansion coefficient match to silicon (a20°C – 300°C = 3.2 x 10–6 K–1)

Alkali-free in synthesis

Excellent transmission

High thermal resistance

Available in very thin thickness from 0.1 – 1.1 mm

[to the product side]

Main characteristics of AF 45^™:

Low thermal expansion coefficient (a20°C – 300°C = 4.5 x 10–6 K–1)

Alkali-free in synthesis

Excellent transmission

High thermal resistance