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Capabilities

Our production lines have integrated all capabilities for processing wafers and substrates. Below is more information about our main capabilities.

Size/Dimensions

SCHOTT offers substrates and wafers in standard sizes of 4”, 5”, 6” and 8” in various shapes (round, squares) with thicknesses from 0.05 to 7.7 mm. 12-inch substrates and wafers will be available soon. For special requests and sizes that differ from our standard dimensions, please contact our sales team.

Edge Treatment

Our expertise in edge treatment enables you to choose between flat or notched, according to the valid SEMI standards.

Polishing/Cleanliness

Our expertise in polishing makes our products unique! Our polishing cabability as one of the “centerpieces” of our processing technology enables the fulfillment of critical demands and the strictest requirements.

TTV/Parallelism very low total thickness variation <10 µm / 5 µm / 2 µm Defect characteristics: scratch/dig (MIL-0-13830A) 20/10, 10/5 Edge/Chamfer: optimized edge profile as C-shape edge, chamfer 30°/45° Notch and orientation flat according to SEMI-standards Roughness (RMS): < 1.5 nm / < 1 nm

The standard of cleanliness required for all components used in microsystems technology is very high. Cleaning of our special glasses is done in ultrasonic baths.

Structuring

Expertise in structuring: With sandblasting technology and the ultrasonic drilling process, SCHOTT has established capabilities to provide specific solutions for structured glass wafers.

US-Drilling Sandblasting Wafer thickness range 400 µm up to 3 mm 30 µm up to 1.5 mm Different hole configurations round holes preferable round and rectangular holes, caverns and channels Location tolerance +/– 85 µm* +/– 60 µm* Min. hole diameter 400 µm 100 µm * Tighter tolerances available upon request

Metrology

Zero defect quality can be realized and guaranteed with highly qualified measuring equipment such as 3D-coordinate measuring machine, Kugler Interferometer, etc.

Clean Room Packaging

We have the capability of clean room production, and all glasses and wafers are inspected under clean room conditions (clean room class 1000) using special measurement and testing instrumentation. Wafers can be packed in professional wafer shipment boxes under clear room condition. Our glasses are then shipped in hermetically sealed trays that enable our customers to use them without delay in their production facilities.

Quality Assurance

Our manufacturing facilities are ISO 9001 certified. Quality control is also in accordance with ISO 9001-2000, and material traceability is guaranteed.