Forschungsberichte 2006-2007



Prozesstechnik

Leib, J.; Bieck, F.; Suthiwongsunthorn, N.; Yamamoto, H.
Mass production of wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications
Advanced Metallization Conference 2006, San Diego, CA / Materials Research Society, Warrendale, PA, 2007, p. 677-682
Maul, J.; Lin, J.; Oelsner, A.; Valdaitsev, D.; Weber, N.; Escher, M.; Merkel, M.; Seitz, H.; Heinzmann, U.; Kleineberg, U.; Schönhense, G.
Phase defect inspection of multilayer masks for 13.5 nm optical lithography using PEEM in a standing wave mode
Surface Science 601. 2007 (20), p. 4758-4763
Ngo, H.-D.; Hiess, A.; Seidemann, V.; Studzinski, D.; Lange, M.; Leib, J.; Shariff, D.; Ashraf, H.; Steel, M.; Atabo, L.; Reast, J.
Plasma etching of tapered features in silicon for MEMS and wafer level packaging applications
Journal of Physics: Conference Series 34. 2006, p. 271-276
Rastegar, A.; Eichenlaub, S.; Ikuta, Y.; Popp, H.; Goncher, K.; Marmillion, P.
Removing sub-50nm particles during blank substrate cleaning
Solid State Technology 49. 2006 (4), p. 47-54
Seitz, H.; Renno, M.; Leutbecher, T.; Olschewski, N.; Reichardt, T.; Walter, R.; Popp, H.; Heß, G.; Letzkus, F.; Butschke, J.; Irmscher, M.
EUVL mask blanks: recent results on substrates, multilayers and the dry etch process of TaN-absorbers
Emerging Lithographic Technologies X, Parts 1 and 2 / Lercel, M.J., ed., Bellingham, WA: SPIE, 2006, article no. 615109. - (Proceedings of SPIE ; 6151)
Shariff, D.; Suthiwongsunthorn, N.; Bieck, F.
Via interconnections for wafer level packaging: impact of via shape on spray coating behavior
EPTC 2006: 8. Electronic Packaging Technology Conference, Singapore; Vols. 1 and 2 / IEEE, New York, 2006, p. 820-824
Shariff, D.; Suthiwongsunthorn, N.; Bieck, F.; Leib, J.
Via interconnections for wafer level packaging: impact of tapered via shape and via geometry on product yield and reliability
57. Electronic Components and Technology Conference, Reno, NV, 2007 / New York: IEEE, 2007, p. 858-863
Tangaha, D.; Bieck, F.
Dicing of optical wafer level packages
EPTC 2006: 8. Electronic Packaging Technology Conference, Singapore; Vols. 1 and 2 / IEEE, New York, 2006, p. 260-264
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