Striving for extra added value
Improved surface quality
In addition to the five axis machining center, the unit has another machine
at its disposal: a wafer saw working with a dicing disk and a high frequency spindle rotating at 80,000 rpm. This CNC (computerized numerical control) four axis machine is also fitted with a turntable and can grind components up to a size of 200 x 200 x 3 millimeters. For the fine grinding of flat surfaces, a single sided lapping machine is being added to the center. This can be fitted with a pellet tool. This procedure allows improved surface qualities compared to kinematically related lapping with considerably higher removal rates. In addition to the treatment of complex components and the manufacture of prototypes, the fine machining center will also be used for technology development. In the past, development opportunities have largely been restricted to new grinding processes or testing new grinding tools. For the future, a further extension is being planned so that a considerable part of the secondary processing technologies relevant to SCHOTT will be available in the fine machining center.