New solutions with improved properties
As the mount for the various components, the circuit board is the most important element in electronic interconnection technology. Components are assembled or etched onto the board and electrically connected to each other by copper circuits. In particular, t he highly integrated components with several hundred connections require a lot of space on the circuit board, which is often not available because of the ever-increasing miniaturization in microelectronics. The challenge is that new generation electronic devices are supposed to be smaller and lighter, while at the same time offering more functions.
Although it is true that today’s standard materials will continue to play an important role in circuit board production, the demand for innovative alternatives with optimized properties is nevertheless growing. There are several reasons for this trend. First, the structures that are printed on the boards are becoming increasingly more complex. Second, the speed of data transmissions is reaching higher and higher levels. And third, environmental concerns are gaining more and more weight.
As a result, materials for circuit boards must meet ever-increasing demands that cannot be fulfilled with conventional products. For instance, extremely fast transmission rates of more than 2.5 gigabyte per second are now the order of the day. And the data have to be electrically transferred trouble free and with as little loss as possible. In addition, the density of the connections and the heat created in the circuit board as a consequence of higher performing components are steadily increasing. Thin glass offers very attractive possibilities as a base material for multilayer laminates to meet these future prerequisites. In its simplest form, the laminate consists of a thin glass substrate that is sandwiched between two copper foils, which are clad to the substrate by a resin. Several of these layers can then be assembled to multilayer laminates with the help of prepreg layers made from glass fiber reinforced adhesives.
Thin glass offers many advantages
Innovations offer major market opportunities