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Sensors / Metrology and Control Engineering

Wafer Inspection
Light guide for wafer inspection
Light guide for wafer inspection
Defects in a processed or partly processed semiconductor wafer, or other similar three-dimensional periodic pattern formed on a substrate surface, are detected by light diffraction. Incident monochromatic light (improves contrast for finding defects compared to polychromatic light) is provided from an elongated and extended source to illuminate the entire wafer surface. The light diffracted from the surface of the substrate is then detected. By use of automated image processing techniques, wafer macro inspection is thereby automated. The elongated and extended light source allows light at different angles to be incident upon each point of the wafer surface, thereby allowing defect detection for an entire wafer surface in a single field of view and reducing inspection time.



Contact

Lighting and Imaging
SCHOTT AG
Andrea Eisenberger

Otto-Schott-Str. 2
55127 Mainz
Germany
 +49 (0)6131/66-7752
 +49 (0)6131/66-7850
E-mail
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Trade Fairs & Events

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23.03 - 25.03.2010

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